Patents Assigned to Sensors, Inc.
  • Patent number: 7570065
    Abstract: Cylindrical capacitance force sensing device/method is disclosed. In one embodiment, an apparatus includes a capacitor having two parallel conductive surfaces, a cylindrical housing with a cover plate to encompass the capacitor, and a sensor in the cylindrical housing to generate a measurement based on a change in a distance between the two conductive surfaces when the cover plate is deflected by a load applied on the cover plate. In another embodiment, a method may include applying a load on top of a housing which encompasses a capacitive sensor having two parallel conductive surfaces to produce a deflection of a cover plate of the housing, automatically generating a measurement from the capacitive sensor when a distance between the two parallel conductive surfaces is charged due to the deflection of the cover plate, and decreasing an error in the measurement via stabilizing to a mounting surface.
    Type: Grant
    Filed: March 1, 2006
    Date of Patent: August 4, 2009
    Assignee: Loadstar Sensors Inc
    Inventors: Divyasimha Harish, William D. Dallenbach, King Wong, John Schultz
  • Publication number: 20090192755
    Abstract: Magnetic field sensor probes are disclosed which comprise primary or drive windings having a plurality of current carrying segments. The relative magnitude and direction of current in each segment are adjusted so that the resulting interrogating magnetic field follows a desired spatial distribution. By changing the current in each segment, more than one spatial distribution for the magnetic field can be imposed within the same sensor footprint. Example envelopes for the current distributions approximate a sinusoid in Cartesian coordinates or a first-order Bessel function in polar coordinates. One or more sensing elements are used to determine the response of a test material to the magnetic field. These sense elements can be configured into linear or circumferential arrays.
    Type: Application
    Filed: November 7, 2008
    Publication date: July 30, 2009
    Applicant: JENTEK Sensors, Inc.
    Inventors: Yanko Konstantinov Sheiretov, Neil J. Goldfine, Andrew P. Washabaugn, Darrell E. Schlicker
  • Patent number: 7566875
    Abstract: A photodetector having sensitivity in a wide temperature range in both an infrared and an ultraviolet band is provided. The photodetector is formed on a single chip and is designed to be blind to solar or visible radiation. Structures disclosed allow fast and efficient detection of signals with high spatial and temporal resolution. Such sensors may be used for multi-pixel focal arrays and applied for fire detection applications, various space- and military-related applications and other applications. A method for increasing rejection of visible light by the IR sensitive material is also provided.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: July 28, 2009
    Assignee: Integrated Micro Sensors Inc.
    Inventors: David Starikov, Abdelhak Bensaoula
  • Publication number: 20090173640
    Abstract: The present invention is directed to the detection of target analytes using electronic techniques, particularly AC techniques.
    Type: Application
    Filed: October 30, 2007
    Publication date: July 9, 2009
    Applicant: Clinical Micro Sensors, Inc.
    Inventors: Stephen D. O'Connor, Jon Faiz Kayyem, Thomas J. Meade
  • Publication number: 20090166196
    Abstract: The invention relates generally to methods and apparatus for conducting analyses, particularly microfluidic devices for the detection of target analytes.
    Type: Application
    Filed: October 30, 2007
    Publication date: July 2, 2009
    Applicant: Clinical Micro Sensors, Inc.
    Inventor: Jon Faiz Kayyem
  • Publication number: 20090153297
    Abstract: A unitized smart card device with a partial fingerprint sensor, ergonomic guides and a processor is disclosed. The smart card contains secure memory, battery, and a processor to run the fingerprint sensor. The ergonomic guides help insure that the users finger properly swipes the fingerprint sensor. The smart card be used on a backwards compatible “dumb credit card” basis, or it may dock with an external smart card docking station. This docking station may act to facilitate communication between the smart card's fingerprint sensor and its onboard secure memory; and external computerized devices. The docking station itself may be configured with slots or other openings to allow users to access the smart card's fingerprint sensor while the smart card is docked with the docking station. The docking station itself may contain ergonomic guides to help ensure that the smart card's fingerprint sensor is used (swiped) in a correct manner.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Applicant: Validity Sensors, Inc.
    Inventor: Lawrence C. Gardner
  • Publication number: 20090154779
    Abstract: A method and device for removing common artifacts, such as stiction, from fingerprint scans created by partial fingerprint scanners. The partial fingerprint scanner data is assessed to determine if successive partial fingerprint images are overly similar to each other, which can occur during stiction. If this similarity exceeds a preset threshold, then at least some of the overly similar partial images will be removed (redacted) from the overall image dataset. The complete overall image is generated from the redacted data set. This method is particularly useful for creating “intelligent” low-cost, low power partial fingerprint scanners and scanner driver chips that can pre-process the partial fingerprint data that is generated during the course of a finger swipe, and remove stiction artifacts on a real-time or near-real time basis using relatively simple and low power on-chip processing circuits, and then send the corrected data to more sophisticated processors for subsequent fingerprint analysis.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Applicant: Validity Sensors, Inc.
    Inventors: Pallavi Satyan, Philip Yiu Kwong Chan
  • Publication number: 20090155456
    Abstract: The invention is an enhanced security fingerprint scanner method and system designed to minimize the risk of fingerprint “spoofing” by minimizing the probability that latent fingerprints from authorized users will be inadvertently left on the device. In a preferred embodiment, surfaces of the device where the probably of authorized users inadvertently leaving latent fingerprints is particularly high are covered with fingerprint resistant or camouflaging material.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Applicant: Validity Sensors, Inc.
    Inventors: Fred George Benkley, David Joseph Geoffroy
  • Patent number: 7539003
    Abstract: The devices presented herein are capacitive sensors with single crystal silicon on all key stress points. Isolating trenches are formed by trench and refill forming dielectrically isolated conductive silicon electrodes for drive, sense and guards. For pressure sensing devices according to the invention, the pressure port is opposed to the electrical wire bond pads for ease of packaging. Dual-axis accelerometers measuring in plane acceleration and out of plane acceleration are also described. A third axis in plane is easy to achieve by duplicating and rotating the accelerometer 90 degrees about its out of plane axis Creating resonant structures, angular rate sensors, bolometers, and many other structures are possible with this process technology. Key advantages are hermeticity, vertical vias, vertical and horizontal gap capability, single crystal materials, wafer level packaging, small size, high performance and low cost.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: May 26, 2009
    Assignee: LV Sensors, Inc.
    Inventors: Curtis A. Ray, Janusz Bryzek
  • Patent number: 7533575
    Abstract: Magnetic or electric field sensors are mounted against a material surface and used for stress, strain, and load monitoring of rotating components such as vehicle drive trains. The stationary sensors are mounted at multiple locations around the component and used assess the stress on the component at multiple rotational positions. The sensor response is typically converted into a material property, such as magnetic permeability or electrical conductivity, which accounts for any coating thickness that may be present between the sensor and mounting surface. The sensors are not in direct contact with the rotating component and are typically mounted on an annular material or ring that encircles the rotating component. Measurements of the annular material properties, such as the stress, are related to the stress on the rotating component and discrete features on the component.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: May 19, 2009
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J. Goldfine, Darrell E. Schlicker, David C. Grundy, Yanko K. Sheiretov, Leandro M. Lorilla, Vladimir A. Zilberstein, Volker Weiss, J. Timothy Lovett, Andrew P. Washabaugh
  • Patent number: 7526964
    Abstract: Methods are described for the use of conformable eddy-current sensors and sensor arrays for characterizing residual stresses and applied loads in materials. In addition, for magnetizable materials such as steels, these methods can be used to determine carbide content and to inspect for grinding burn damage. The sensor arrays can be mounted inside or scanned across the inner surface of test articles and hollow fasteners to monitor stress distributions. A technique for placing eddy-current coils around magnetizable fasteners for load distribution monitoring is also disclosed.
    Type: Grant
    Filed: January 24, 2003
    Date of Patent: May 5, 2009
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J. Goldfine, Vladimir A. Zilberstein, James M. Fisher, David C. Grundy, Darrell E. Schlicker, Vladimir Tsukernik, Robert J. Lyons, Ian C. Shay, Andrew P. Washabaugh
  • Patent number: 7528598
    Abstract: Damage and usage conditions in the vicinity of fasteners in joined structures are nondestructively evaluated using the fasteners themselves. Sensors or sensor conductors are embedded in the fasteners or integrated within the fastener construct, either in the clearance gap between the fastener and the structure material or as an insert inside the shaft or pin of the fastener. The response of the material to an interrogating magnetic or electric field is then measured with drive and sense electrodes both incorporated into the fastener or with either drive or sense electrodes external to the fastener on the material surface. In another configuration, an electric current is applied to one or more fasteners and the electric potential is measured at locations typically between the driven electrodes applying the current. The potential is measured circumferentially around the fastener at locations on the material surface or across pairs of fasteners throughout or along the joint.
    Type: Grant
    Filed: June 22, 2006
    Date of Patent: May 5, 2009
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J. Goldfine, David C. Grundy, Andrew P. Washabaugh, Yanko K. Sheiretov, Darrell E. Schlicker
  • Patent number: 7521945
    Abstract: An embodiment of the present invention provides for a sensing element comprising a non-conductive housing with three chambers for detecting oil conductivity, additive depletion and oxidation, and water contamination, respectively. Through the monitoring of an array of oil sensors, an early warning of oil degradation due to oxidation is provided. The monitoring system further detects excess soot, water and other contaminants in the oil. The oil sensor array and related monitoring system decrease the likelihood of catastrophic engine failure through the early detection and warning of a decrease in oil quality thereby reducing vehicle owner outlays for servicing and disposal fees while further aiding in the satisfaction of environmental protection regulations.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: April 21, 2009
    Assignee: Voelker Sensors Inc.
    Inventors: Joe D. Hedges, Paul J. Voelker
  • Patent number: 7518493
    Abstract: The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: April 14, 2009
    Assignee: LV Sensors, Inc.
    Inventors: Janusz Bryzek, Curtis Ray, Brian Lee Bircumshaw, Elizabeth A. Logan
  • Patent number: 7518360
    Abstract: Combined wound and micro-fabricated winding constructs are described for the inspection of materials and the detection and characterization of hidden features or flaws. These constructs can be configured as sensors or sensor arrays that are surface mounted or scanned over conducting and/or magnetizable test materials. The well-defined geometry obtained micro-fabricated windings and from carefully wound coils with known winding positions permits the use of model based inversions of sensed responses into material properties. In a preferred embodiment, the primary winding is a wound coil and the sense elements are etched or printed. The drive or sense windings can also be mounted under fasteners to improve sensitivity to hidden flaws. Ferrites and other means may be used to guide the magnetic flux and enhance the magnetic field in the test material.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: April 14, 2009
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J. Goldfine, Darrell E. Schlicker, Andrew P. Washabaugh, Ian C. Shav, Mark D. Windoloski, Christopher Root, Vladimir A. Zilberstein, David C. Grundy, Vladimir Tsukernik
  • Patent number: 7514228
    Abstract: The invention relates to novel methods and compositions for the detection of analytes using the nuclear reorganization energy, ?, of an electron transfer process.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: April 7, 2009
    Assignee: Clinical Micro Sensors, Inc.
    Inventor: Thomas J. Meade
  • Publication number: 20090057147
    Abstract: The invention is directed to devices that allow for simultaneous multiple biochip analysis. In particular, the devices are configured to hold multiple cartridges comprising biochips comprising arrays such as nucleic acid arrays, and allow for high throughput analysis of samples.
    Type: Application
    Filed: October 31, 2007
    Publication date: March 5, 2009
    Applicant: Clinical Micro Sensors, Inc.
    Inventor: Jon Faiz Kayyem
  • Publication number: 20090001974
    Abstract: An apparatus for the nondestructive measurement of materials that includes at least two layers of electrical conductors. Within each layer, a meandering primary winding is used to create a magnetic field for interrogating a test material while sense elements or conducting loops within each meander provide a directional measurement of the test material condition. In successive layers extended portions of the meanders are rotated so that the sense elements provide material condition in different orientations without requiring movement of the test circuit or apparatus. In a bidirectional implementation the angle is 90° while in a quadridirectional implementation the relative angles are ?45, 0, 45, and 90°. Multidirectional permeability measurements are used to assess the stress or torque on a component. These measurements are combined in a manner that removes temperature effects and hysteresis on the property measurements.
    Type: Application
    Filed: June 12, 2008
    Publication date: January 1, 2009
    Applicant: JENTEK Sensors, Inc.
    Inventors: Yanko K. Sheiretov, Neil J. Goldfine, Todd M. Dunford, Scott A. Denenberg, David C. Grundy, Darrell E. Schlicker, Andrew P. Washabaugh, Karen E. Walrath
  • Patent number: 7470966
    Abstract: The present invention is directed towards radiation detectors and methods of detecting incident radiation. In particular the present invention is directed towards photodiodes with controlled current leakage detector structures and a method of manufacturing photodiodes with controlled current leakage detector structures. The photodiodes of the present invention are advantageous in that they have special structures to substantially reduce detection of stray light. Additionally, the present invention gives special emphasis to the design, fabrication, and use of photodiodes with controlled leakage current.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: December 30, 2008
    Assignee: UDT Sensors, Inc.
    Inventors: Peter Steven Bui, Narayan Dass Taneja
  • Patent number: 7468556
    Abstract: Improved sensor packaging is provided with a hybrid integration approach. In one example, an application specific integrated circuit (ASIC) for sensor signal conditioning is packaged. The ASIC package has an aperture in it that exposes a chip to chip bonding interface of the ASIC chip. The rest of the ASIC chip is surrounded by the package, including the connections between the external package leads and the ASIC chip. A sensor chip, also having a chip to chip bonding interface, is disposed in the package aperture and bonded to the ASIC chip such that the two chip to chip bonding interfaces are connected. Flip chip bonding of the sensor chip to the ASIC chip is a preferred approach for chip to chip bonding. The vertical gap between the two chips can be filled in by an underfill process. The lateral gap between the sensor chip and the package can also be filled.
    Type: Grant
    Filed: June 18, 2007
    Date of Patent: December 23, 2008
    Assignee: LV Sensors, Inc.
    Inventors: Elizabeth A. Logan, Curtis A. Ray