Patents Assigned to Sensors, Inc.
  • Patent number: 11543388
    Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: January 3, 2023
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford
  • Publication number: 20220411261
    Abstract: In some embodiments, electromechanical systems including a semiconductor layer that has a planar surface and includes conductive and adjacent non-conductive regions and a hermetic seal applied above the planar surface and methods of manufacturing the systems are disclosed. In some embodiments, electromechanical devices that include first and second planar semiconductor layers are disclosed. Each of the semiconductor layers includes conductive regions, and at least one conductive region from each of the layers is electrically coupled to each other. Methods of manufacturing the electromechanical devices are also disclosed.
    Type: Application
    Filed: February 19, 2021
    Publication date: December 29, 2022
    Applicant: Obsidian Sensors, Inc.
    Inventors: John HONG, Tallis CHANG, Sean ANDREWS, Jan BOS, Jia-Wei MA
  • Publication number: 20220412918
    Abstract: Eddy current sensing is governed by the diffusion equation of magnetoquasistatic fields. As such the eddy current sensor's proximity to the object to be inspected (i.e., “liftoff”) significantly affects the sensor's response signal. Methods and apparatus are disclosed for improving performance for an eddy current sensor, though they may also be used for other sensor types. These solutions are beneficial for both single channel eddy current sensors and arrays, and are particularly beneficial for measuring parts with complex surfaces. In some aspects improved performance is achieved by varying the stiffness of the mechanical support for the sensor. Some mechanical supports may exhibit anisotropic stiffness. After performing a scan with an eddy current array, a multi-channel shape filtering module is applied to improve defect detection. The module reduces the variability of defect response measured due to the unpredictability of the defect location transverse to the scan direction.
    Type: Application
    Filed: September 5, 2022
    Publication date: December 29, 2022
    Applicant: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Mark Windoloski, Todd M Dunford
  • Patent number: 11536839
    Abstract: Devices, methods, and computer program products for measuring the speed of an object. A speed measuring device includes a rangefinder module configured to measure distances from the device to a target object. Activating the device causes the device to measure a first distance from the device to the object along a first line-of-sight, and a second distance from the device to the object along a second line-of-sight. The device determines an angular displacement between the first line-of-sight and the second line-of-sight, and one or more of an elapsed time between measuring the first distance and measuring the second distance and a radial velocity of the object. The device then determines the absolute speed of the object based on the first distance, the second distance, the angular displacement, and one or more of the elapsed time and radial velocity.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: December 27, 2022
    Assignee: Sports Sensors, Inc.
    Inventor: Albert E. Dilz, Jr.
  • Publication number: 20220373367
    Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.
    Type: Application
    Filed: September 16, 2019
    Publication date: November 24, 2022
    Applicant: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
  • Publication number: 20220358630
    Abstract: A system and method are disclosed for enhancing pit detection and sizing in a test object. Response signatures are created and stored in a signature library to characterize various sensor responses (liftoff, orientation) and pit properties (e.g., depth, width), possibly with or without additional considerations (e.g., edges, cracks). A sensor is placed on and scanned across a surface of interest on the test object. During scanning the sensor is measured repeatedly at regular intervals. An encoder may be used to record the sensor position for each measurement. The measurement results are then correlated with one or more signatures in the signature library. A threshold is used to determine if the correlation is indicative of the detection of a pit. If so additional processing may be performed to estimate pit properties.
    Type: Application
    Filed: May 9, 2022
    Publication date: November 10, 2022
    Applicant: JENTEK Sensors, Inc.
    Inventors: Neil J. Goldfine, Andrew P. Washabaugh, Mark Windoloski
  • Publication number: 20220341875
    Abstract: A system and method are provided for performing a hole inspection performance study. Specimens for the performance study are made from a reconfigurable set of inspection plates. Each plate includes multiple test holes which are located symmetrically. The plates may be of various thicknesses and materials. Each test hole may or may not have a feature such as a crack or machining notch. Such features may be located at various positions of the hole, such as at an edge, within the bore, and at various circumferential positions. A specimen is formed by stacking two or more plates and securing the stack together with an alignment tool. A variety of specimens may be formed by using different combinations of inspection plates and flipping and rotating the member plates. A hole inspection system is disclosed as well as an inspection procedure and data processing algorithm for inspecting each hole.
    Type: Application
    Filed: April 27, 2022
    Publication date: October 27, 2022
    Applicant: JENTEK Sensors, Inc.
    Inventors: Stuart Chaplan, Neil Goldfine, Zachary M. Thomas
  • Publication number: 20220341876
    Abstract: A system and method are provided for inspecting challenging material locations such as holes. The system may include a sensor cartridge (“mandrel”) for hole inspection that has a helical portion to which a sensor array is attached. The radius of the helical portion can be increased or decreased by applying a torque to the helical portion thereby allowing the sensor to be inserted into a hole or pressed against the wall of the hole. A scanner is described to which mandrels can be quickly connected and changed enabling an inspector to quickly switch between different mandrels (e.g., for different holes sizes and sensor configurations). Also disclosed is an inspection procedure and data processing algorithm for performing an inspection. The data processing algorithm utilizes a signature library for enhancing the detection or sizing of features of interest such as cracks. The algorithm and library can account for material edges, various material types.
    Type: Application
    Filed: April 27, 2022
    Publication date: October 27, 2022
    Applicant: JENTEK Sensors, Inc.
    Inventors: Todd Dunford, Neil Goldfine, Stuart Chaplan
  • Patent number: 11480481
    Abstract: Methods and apparatus are described that improve the reliability and configurability of sensor systems.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: October 25, 2022
    Assignee: BeBop Sensors, Inc.
    Inventor: Keith A. McMillen
  • Patent number: 11474126
    Abstract: A high precision rotation sensor comprises an inertial mass suspended from a base wherein the mass is responsive to rotational inputs that apply loads to load-sensitive resonators whose changes in resonant frequency are related to the applied loads.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: October 18, 2022
    Assignee: QUARTZ SEISMIC SENSORS, INC.
    Inventors: Jerome M. Paros, Krishna Venkateswara
  • Patent number: 11435317
    Abstract: Eddy current sensing is governed by the diffusion equation of magnetoquasistatic fields. As such the eddy current sensor's proximity to the object to be inspected (i.e., “liftoff”) significantly affects the sensor's response signal. Methods and apparatus are disclosed for improving performance for an eddy current sensor, though they may also be used for other sensor types. These solutions are beneficial for both single channel eddy current sensors and arrays, and are particularly beneficial for measuring parts with complex surfaces. In some aspects improved performance is achieved by varying the stiffness of the mechanical support for the sensor. Some mechanical supports may exhibit anisotropic stiffness. After performing a scan with an eddy current array, a multi-channel shape filtering module is applied to improve defect detection. The module reduces the variability of defect response measured due to the unpredictability of the defect location transverse to the scan direction.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: September 6, 2022
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford
  • Patent number: 11435217
    Abstract: A tank and liquid level indicator has first housing that holds a liquid and a second elongated housing in fluid communication with the first elongated housing so that a liquid level in the second housing is approximately equal to the level in the first housing. A float in the second housing cooperates with the circuitry to operate one or more light switches. A light-transmissive cover is disposed over the light source.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: September 6, 2022
    Assignee: Gems Sensors Inc.
    Inventors: David P. Curry, Douglas Stetson, James B. Dockendorff
  • Publication number: 20220211295
    Abstract: There is provided a device for measuring a user's oxygen-consumption. The device includes a tubular member with a first tapered portion through which an exhalation of air enters into the device, a second tapered portion, and a constriction between the portions thereof. The devices includes a flow sensing mechanism in communication with the first tapered portion of the tubular member. The device includes an oxygen sensor in communication with the first tapered portion of the tubular member. The device is configured such that the oxygen sensor is passively supplied a portion of the exhalation of air by means of positive or negative differential pressure referenced between the first tapered portion and at least one of ambient air and the constriction of the tubular member.
    Type: Application
    Filed: February 24, 2022
    Publication date: July 7, 2022
    Applicant: VO2 Master Health Sensors Inc.
    Inventors: Peter O'Brien, Kyle Halliday, Kenneth Chau, Joshua Brinkerhoff
  • Publication number: 20220178877
    Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.
    Type: Application
    Filed: March 1, 2022
    Publication date: June 9, 2022
    Applicant: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford
  • Publication number: 20220125312
    Abstract: Monitoring of one or more key indicators can provide powerful insights into operation and state of different physical systems. For example, continuous monitoring of multiple analyte in body will allow for detailed insights into personal health and will allow for preventative health management. In this application, we present an ultra-small scale wireless sensing platform capable of long-term wireless in-vivo sensing. The key for extreme miniaturization lies in ultra-low-power compact design and lithographic integration of key system components. The key to low cost is using standard technologies and scalable manufacturing. For example, using standard semiconductor technologies for sensing, processing and wireless operation paves way to a low-cost integrated wireless sensing technology. Modern semiconductor technologies provide the capability to provide low-power and yet powerful electronics functionality in a small (mm-scale) size and wireless operation at high frequency.
    Type: Application
    Filed: December 14, 2021
    Publication date: April 28, 2022
    Applicant: Integrated Medical Sensors, Inc.
    Inventors: Meisam Honarvar Nazari, Muhammad Mujeeb-U-Rahman, Mehmet Sencan
  • Patent number: 11294001
    Abstract: An optical fiber-mounted field sensor for measuring an electric or magnetic field includes an optical fiber configured to receive light from a laser source, a polarizer, a polarization manipulator, electro-optical material or magneto-optical material adjacent to the polarization manipulator, and a high reflection coating. The polarizer is adjacent to an output of the fiber, while the polarization manipulator is adjacent to the polarizer and opposite of the optical fiber. The electro-optical material or magneto-optical material is adjacent to the polarization manipulator, and the high reflection coating is adjacent to the electro-optical material or magneto-optical material. An optical mainframe for sending and receiving optical beams to and from the optical fiber-mounted field sensor is also described.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: April 5, 2022
    Assignee: Advanced Fiber Sensors, Inc.
    Inventors: Kyoung Yang, John Whitaker
  • Patent number: 11284814
    Abstract: There is provided a device for measuring a user's oxygen-consumption. The device includes a venturi tube. The venturi tube has a first tapered portion, a second tapered portion that is more tapered compared to the first tapered portion, and a constriction between the portions thereof. The device includes at least one pressure sensor in communication with the constriction and the first tapered portion of the venturi tube. The device includes an oxygen sensor in communication with the constriction and the first tapered portion of the venturi tube.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: March 29, 2022
    Assignee: VO2 Master Health Sensors Inc.
    Inventors: Peter O'Brien, Kyle Halliday, Kenneth Chau, Joshua Brinkerhoff
  • Patent number: 11282760
    Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: March 22, 2022
    Assignee: Obsidian Sensors, Inc.
    Inventors: Yaoling Pan, Tallis Young Chang, John Hyunchul Hong
  • Patent number: 11284031
    Abstract: A low-power image sensor includes a plurality of light-sensitive pixel cells, a plurality of analog-to-digital converters (ADCs) and image processing circuitry. The image sensor can be disposed in multiple semiconductor layers such that the pixel cells are disposed in a first layer and various other components are disposed in the second layer or between the first layer and the second layer. The image sensor is configured such that the analog output of a pixel cell is sampled by a first ADC and a second ADC within respective first and second dynamic ranges, the second dynamic range being greater than the first dynamic range. The first ADC and the second ADC sample the analog output with different sampling resolutions. The digital outputs of the first ADC and the second ADC are subsequently used by an image processor to generate a pixel value for an image frame.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: March 22, 2022
    Assignee: OBSIDIAN SENSORS, INC.
    Inventor: Lester Joseph Kozlowski
  • Publication number: 20220082525
    Abstract: A sensor device comprises at least one transducer and a sensing material disposed on the transducer. The sensing material adsorbs or absorbs an amount of analyte (e.g., a target gas) that depends on a temperature of the sensing material and a concentration of the analyte. At least one detector is arranged to measure responses of the transducer to sorption or desorption of the analyte in the sensing material while the sensing material is heated and/or cooled according to at least one temperature profile. The device also comprises a humidity sensor that is arranged to detect a humidity level of the environment or sample containing the analyte. A processor or controller is programmed to determine the quantity (e.g.
    Type: Application
    Filed: September 9, 2021
    Publication date: March 17, 2022
    Applicant: MATRIX SENSORS, INC.
    Inventors: David K Britt, Paul R Wilkinson, Steven Yamamoto