Patents Assigned to SensoTek technology Corp.
  • Package structure with optical barrier, optical package structure and manufacturing methods thereof
    Patent number: 9865765
    Abstract: A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: January 9, 2018
    Assignee: SensoTek technology Corp.
    Inventors: Feng-Jung Hsu, Chu-Yuan Yang, Yuan-Ching Hsu, Yi-Hua Chang