Abstract: A Platinum temperature sensor comprises a ceramic substrate and a platinum thin-film resistor applied to said ceramic substrate, a ceramic cover layer and a connecting layer generated from a ceramic green layer by pressure and temperature treatment. The ceramic cover layer is connected with the ceramic substrate in such a way via the connecting layer that the platinum thin-film resistor is sealingly encapsulated with regard to the environment.

Abstract: A Platinum temperature sensor comprises a ceramic substrate and a platinum thin-film resistor applied to said ceramic substrate, a ceramic cover layer and a connecting layer generated from a ceramic green layer by pressure and temperature treatment. The ceramic cover layer is connected with the ceramic substrate in such a way via the connecting layer that the platinum thin-film resistor is sealingly encapsulated with regard to the environment.

Abstract: A platinum temperature sensor comprises a ceramic substrate (4) and a platinum thin-film resistor (2) applied to a main surface of said ceramic substrate. A protective intermediate layer (14, 16) comprises a ceramic layer (14) which, at least in the area of the platinum thin-film resistor (2), is evaporated on the main surface of the ceramic substrate (4) over the full area thereof, and a sintered ceramic paste layer (16) which is applied to the evaporated ceramic layer (14). A protective glaze (18) applied to the protective intermediate layer (14, 16).

Abstract: A sensor component comprises a ceramic support (12) with a metal film (14) applied thereto. At least one connecting wire (16) is electrically connected to the metal film (14) in a contact area (18). A fixing glaze (20) is applied to the metal film (14) and the at least one connecting wire (16) in the contact area (18). The ceramic support (12) has at least one recess (24) in the area of the fixing glaze (20).

Abstract: A method of producing components, which include a metal film on a carrier, comprises the following steps: applying a metal film to a first carrier; structuring the metal film; reducing an adherence between the first carrier and the metal film by electrically conductive contacting of the metal film; immersing the first carrier with the metal film in an aqueous electrolyte solution; immersing an electrode in the aqueous electrolyte solution; and applying a voltage between the metal film and the electrode; applying a second carrier to the metal film; and removing the second carrier with the metal film from the first carrier.

Abstract: A method for producing a sensor which is used for sensing a temperature and/or a flow and which comprises a carrier and a structured resistance layer arranged on said carrier, comprises the steps of providing a mixture consisting of platinum resinate paste and a rhodium resinate paste, printing the mixed resinate paste by means of a screen printing process onto an aluminium oxide substrate, drying the paste which has been applied by printing, burning in the paste at such a temperature for such a period of time that a resinate component contained in the layer will be burnt out, repeating the last-mentioned three steps on the same substrate until a desired overall layer thickness has been obtained, and tempering the substrate with the whole layer so as to obtain a high and stable temperature coefficient.