Abstract: An integrated circuit-type DIP package for micromachined (silicon) sensors such as pressure sensors has the fluid ports necessary for operation of the pressure sensor located laterally (rather than extending vertically) from the upper and lower portions of the assembled package. This lateral arrangement includes a first nozzle extending laterally from the upper surface of the package cover (lid) and a side port communicating with a second nozzle located in the lateral surface of the package body. This provides a low profile package by eliminating the otherwise vertical nozzles and also allows mounting of such a package on a printed circuit board without the need to drill a hole to accommodate the nozzle extending from the bottom of the package. The side ports also enhance the ability to mount the package and temporarily plug the side ports during cleaning of the printed circuit board, since the side ports are easily accessible rather than being hidden underneath the package when mounted.

Abstract: A non-invasive sensor assembly device includes a pedestal mounted sensor die for stress isolation of the sensor die from external stresses, a substrate and die porting configuration to limit exposure of the sensor assembly to only the interior of the sensor die and a connecting tube to provide significant isolation of the sensor assembly and its constituent parts from the fluid stream, and an inert coating conformally deposited on the inside surfaces of the die, pedestal, and connecting tube that are in contact with the fluid media to thereby provide complete isolation of the sensor assembly from the media.

Abstract: A silicon pressure chip operates in a two-wire resistive mode. A thin-film resistor located on a long silicon beam which is the thicker portion of a thin diaphragm is partially shorted out by a metallized deflection stop. The pressure response of the resistor is determined by the resistor layout.

Abstract: A device and method for trimming diffused or implanted resistors incorporated within a silicon sensor. Current pulses are applied to cause the migration of aluminum contacts in silicon, resulting in controllable incremental reductions in resistor value. The resistors are symmetrically positioned within a Wheatstone bridge to correct offset voltage and sensitvity erros that result from manufacturing tolerances.