Abstract: An integrated circuit-type DIP package for micromachined (silicon) sensors such as pressure sensors has the fluid ports necessary for operation of the pressure sensor located laterally (rather than extending vertically) from the upper and lower portions of the assembled package. This lateral arrangement includes a first nozzle extending laterally from the upper surface of the package cover (lid) and a side port communicating with a second nozzle located in the lateral surface of the package body. This provides a low profile package by eliminating the otherwise vertical nozzles and also allows mounting of such a package on a printed circuit board without the need to drill a hole to accommodate the nozzle extending from the bottom of the package. The side ports also enhance the ability to mount the package and temporarily plug the side ports during cleaning of the printed circuit board, since the side ports are easily accessible rather than being hidden underneath the package when mounted.

Abstract: A force sensor assembly incorporates an integrated plunger to provide an economical assembly which can be calibrated and mounted as a single unit. The force sensor assembly utilizes a retainer to movably capture a solid interface within an opening in the retainer. The solid interface includes a flange positioned within the assembly below the retainer opening. The flange dimensions are greater than the retainer opening to retain the solid interface within the assembly. The retainer is attached to a housing body having a gel filled cavity underlying the retainer opening. A diaphragm free floats on the gel within the housing body and contacts the solid interface. The gel transmits a force exerted on the diaphragm from the solid interface to a pressure sensor mounted at the base of the housing body cavity. A ceramic substrate having an integrated resistor network supports the pressure sensor and an amplifier.

Abstract: An integrated circuit-type DIP package for micromachined (silicon) sensors such as pressure sensors has the fluid ports necessary for operation of the pressure sensor located laterally (rather than extending vertically) from the upper and lower portions of the assembled package. This lateral arrangement includes a first nozzle extending laterally from the upper surface of the package cover (lid) and a side port communicating with a second nozzle located in the lateral surface of the package body. This provides a low profile package by eliminating the otherwise vertical nozzles and also allows mounting of such a package on a printed circuit board without the need to drill a hole to accommodate the nozzle extending from the bottom of the package. The side ports also enhance the ability to mount the package and temporarily plug the side ports during cleaning of the printed circuit board, since the side ports are easily accessible rather than being hidden underneath the package when mounted.

Abstract: A silicon pressure sensor chip has a shear element on a sculptured diaphragm. The shear element is a piezo-resistive four-terminal resistor which is oriented so as to respond to the in-plane shear stress component in the diaphragm. The shear element is located on a thick shelf which is a portion of the sculptured diaphragm, which also has a thinner portion. This diaphragm configuration increases the bending moment at the location of the sensing element through the load of the thin portion of the diaphragm, which is suspended along the periphery of the thick shelf.

Abstract: A silicon accelerometer chip has a seismic mass (which is a gold sphere) fixed in a cavity formed in a boss supported by beams. Pizeo-resistors forming a Wheatstone bridge are formed in the beams. The cavity is formed by anisotroptically etching the boss, so that the cavity is self-aligned to the sphere.