Patents Assigned to Sensytec, Inc.
  • Patent number: 12055505
    Abstract: Embodiments are described herein for a sensor device created for determining and monitoring quality and strength developments in concrete and other materials using temperature and electrical resistivity parameters. The embodiments described herein may be utilized in the construction industry for real-time monitoring of concrete and cement structures or for monitoring the strength and quality of soils, polymers, and liquid additives as well. According to various embodiments, alternating current (AC) electrical and temperature measurements may be performed to correlate to the quality and performance of the concrete, polymers, treated soils, and other materials. These measurements may be made by compact sensor devices that are configured to read both temperature and AC electrical measurements continuously to quantify the performance of materials.
    Type: Grant
    Filed: February 21, 2023
    Date of Patent: August 6, 2024
    Assignee: Sensytec, Inc.
    Inventors: Sai Anudeep Reddy Maddi, Derman Smith Santander Amador, Ody Roy La Paz Guerra
  • Patent number: 11614420
    Abstract: Embodiments are described herein for a sensor device created for determining and monitoring quality and strength developments in concrete and other materials using temperature and electrical resistivity parameters. The embodiments described herein may be utilized in the construction industry for real-time monitoring of concrete and cement structures or for monitoring the strength and quality of soils, polymers, and liquid additives as well. According to various embodiments, alternating current (AC) electrical and temperature measurements may be performed to correlate to the quality and performance of the concrete, polymers, treated soils, and other materials. These measurements may be made by compact sensor devices that are configured to read both temperature and AC electrical measurements continuously to quantify the performance of materials.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: March 28, 2023
    Assignee: Sensytec, Inc.
    Inventors: Sai Anudeep Reddy Maddi, Derman Smith Santander Amador, Ody Roy De La Paz Guerra