Patents Assigned to Sentek Pty Ltd
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Patent number: 11310970Abstract: Crops for human and animal consumption of many types are well known by their respective growers. Years of experience in the field provide the grower knowledge about a range of conditions that lead to the full spectrum of crop yields and crop quality, and each grower creates a store of knowledge which they can combine with the available measures of those conditions.Type: GrantFiled: August 22, 2018Date of Patent: April 26, 2022Assignee: SENTEK PTY LTDInventor: Peter Buss
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Patent number: 11226304Abstract: An apparatus for selectively detecting an anion in a medium and/or selectively measuring the concentration of an anion in a medium. The apparatus comprises at least one sensor and a conductive polymer film and is configured such that dielectric and/or electric property changes of the conductive polymer film can be detected by the sensor when the conductive polymer film is in hydraulic contact with the medium or after it has been in hydraulic contact with the medium. Methods of selectively detecting an anion in a medium and/or selectively determining a concentration of an anion in a medium are also provided.Type: GrantFiled: October 13, 2017Date of Patent: January 18, 2022Assignees: University of South Australia, Sentek Pty LtdInventors: Drew Raymond Evans, Sam Rudd, Peter Buss, Michael Reginald Dalton, Michael Robert Portmann
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Patent number: 10589332Abstract: An auger useable for creating an opening in the ground for a soil sensor housing wherein the sensor housing has a predetermined volume and a tapered outer surface, includes an auger made in accordance with the methods described and defined in this specification. The auger having a shaft having an outer surface of circular cross-section having an larger outer diameter at one end than the other end and a strip material having a helical shape with an inner wall having a larger inner diameter at one end than the other end of the helical shape wherein the helically shaped material is fixed over the outer diameter of the shaft to form a tapered auger with helical flighting. The volume of the opening created by an auger in the ground will provide a matching volume for a sensor housing of a predetermined volume such that substantially the full length of the tapered outer surface of the sensor is adjacent the ground along the full length/depth of the created opening.Type: GrantFiled: April 10, 2015Date of Patent: March 17, 2020Assignee: SENTEK PTY LTDInventor: Peter Tucker
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Patent number: 10359384Abstract: The field is sensors used in the ground and in particular the provision of a sensor array element for a sensor array useable in housing that has a tapered internal and external shape. The lack of air spaces and gaps, in particular, between the outer surface of the hollow elongate sensor housing and the surrounding ground is substantially avoided when using a tapered housing. A sensor array element is disclosed including a carrier sheet of flexible material formable into a shape which substantially conforms with the shape of the inner wall of said elongate housing. The carrier sheet has electrically conductive regions wherein at least one pair of electrically conductive regions are shaped and located near enough each other to form a capacitive element. The carrier sheet has at least two pairs of electrically conductive regions forming a pair of capacitive elements, and adjacent pairs of capacitive elements have a different diameter.Type: GrantFiled: April 10, 2015Date of Patent: July 23, 2019Assignee: SENTEK PTY LTD.Inventor: Michael Portmann
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Patent number: 10060873Abstract: A sensor housing having a body for housing a soil moisture sensor arrangement with sensors arranged within and along the length of the housing, the body is shaped so that there is a continuous taper from the head end having the larger outer diameter to the inserted end having the smaller outer diameter, and the volume of the opening created by an auger in the ground will provide a matching volume for the sensor housing of a predetermined volume such that the entire tapered outer surface of the sensor is adjacent the ground along the full length of the created opening. The sensors include at least a first capacitive element, and a second capacitive element that has a maximum outer diameter smaller than the maximum outer diameter of the first capacitive element.Type: GrantFiled: April 10, 2014Date of Patent: August 28, 2018Assignee: SENTEK PTY LTD.Inventor: Peter Buss
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Publication number: 20160061762Abstract: The field of the invention is soil sensors and in particular the sensor clement housing for the placement of a soil sensor housing in the soil. The housing having a body adapted for housing a soil moisture sensor arrangement wherein sensors are arranged within and along the length of the housing, the body having a head end and an inserted end, the body shaped so that the maximum outer diameter of the inserted end is smaller than the maximum outer diameter of the head end of the body, and the body adapted to be inserted into the prepared opening such that the outer surface of the body is in conformance with the soil forming the prepared opening along the full length of the housing.Type: ApplicationFiled: April 10, 2014Publication date: March 3, 2016Applicant: SENTEK PTY LTD.Inventor: Peter BUSS
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Patent number: 7240743Abstract: This invention relates to probes used in the ground for the collection of data relating to soil conditions and in particular to a construction and method of insertion of probe bodies that will house such probes. A probe body insertion apparatus comprises a tool for forming an opening in the soil using a stabilization device that encourages the excavation of an opening that is orthogonal to the surrounding ground level and which is smaller in diameter than the soil probe body to be inserted. The inserted end of the probe body is formed with a hollow portion having an opening that is downwardly facing and adapted to slice away a portion of the prepared opening. The soil sliced away falls to the base of the prepared opening. The hollow portion of the inserted end of the probe body envelopes the loose soil but allows the probe body to be inserted to the desired depth.Type: GrantFiled: October 4, 2002Date of Patent: July 10, 2007Assignee: Sentek Pty LtdInventors: Peter Buss, Michael Reginald Dalton, Riccardo Angelo Leo Gatto, James Dominic Buob
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Patent number: 7042234Abstract: A soil parameter measurement arrangement includes a capacitive based soil moisture and salinity sensor, a predetermined moisture migration medium located in a volume adjacent said sensor so that the medium substantially occupies the field of influence of said sensor. The medium is in moisture communication with the soil to be measured, and said sensor is adapted to measure and produce data representative of the volumetric water content of said medium. A sensor data processing means determines both the soil moisture and salinity of said medium. By using the measured volumetric soil moisture content and the moisture release curve of the medium, it is possible to derive the matric potential of the soil. The measured salinity of the medium corresponds to the salinity of the soil that is in moisture communication with the medium.Type: GrantFiled: December 16, 2003Date of Patent: May 9, 2006Assignee: Sentek Pty LtdInventor: Peter Buss
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Patent number: D672257Type: GrantFiled: May 16, 2011Date of Patent: December 11, 2012Assignee: Sentek Pty Ltd.Inventors: Peter Buss, Michael Reginald Dalton, David Spencer, Michael Portmann