Abstract: A heat dissipating microdevice is made from comprising the steps of: a board including an insulator layer having a first and facing second surfaces and a conductor layer on the first surface by forming in the layer a hole that extends between the surfaces to form a fluid microsystem including: first and second micro-channel structures disposed respectively in first and second areas of the board and bounded by the layer, and first and second micro-conduit structures that permit fluid communication between the micro-channel structures. The first micro-conduit structure has a first end in fluid communication with the second micro-channel structure and a second end section in fluid communication with the first micro-channel structure. The second micro-conduit structure has a first end section in fluid communication with the first micro-channel structure and a second end section in fluid communication with the second micro-channel structure. A cover is put on the second surface.

Abstract: A film sticking/testing equipment mainly includes a transmission mechanism, a film sticking apparatus and a test apparatus. The transmission mechanism is used for delivering at least a touch pad. The film sticking apparatus has a film release base to allow a protect film being released from a rolling belt, which temporarily adheres with the protect film. The protect film is attracted by the film sticking apparatus and adhered to the surface of the touch pad by way of vacuum suction. The testing apparatus provides a test rod traveling along a preset locus on the touch pad to take the output test value of the touch pad and input to the computer device such that the test value is compared with the preset value in the computer device to distinguish qualified touch pads from unqualified touch pads.

Abstract: An object (130), e.g. a human finger or a stylus, is sensed with a plurality of conductors (120, X1, . . . XN). The conductor processing times (TX1, TX2, . . . TXN) but are shifted relative to one other.

Abstract: A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.