Patents Assigned to Sentinel Connector Systems Inc.
  • Publication number: 20200169047
    Abstract: An arc prevention system including a jack having a receptacle, a modular plug sized to be positioned in the receptacle of the jack, the modular connector including, a plurality of contacts, with at least two of the contacts creating an energized electrical path with an external power source in electrical communication with the external power source, a latch extending from a top surface of the modular plug, a switching unit positioned on the latch, a control circuit in electrical communication with the switch and the at least two energized contacts, where the electrical path between the control circuit and the switching unit is not energized, and the control circuit adjusts the energized electrical path to a predetermined electrical level.
    Type: Application
    Filed: January 30, 2020
    Publication date: May 28, 2020
    Applicant: Sentinel Connector Systems, Inc.
    Inventors: Robert Brennan, Justin Wagner, Brett Robinson
  • Patent number: 10547146
    Abstract: A modular connector including a pair of energizable contacts that facilitate an electrical path which may be de-energized by a switch component.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: January 28, 2020
    Assignee: Sentinel Connector Systems, Inc.
    Inventors: Robert Brennan, Justin Wagner
  • Publication number: 20190274211
    Abstract: A communication plug including a substrate having a top surface, a bottom surface, opposing side surfaces and opposing end surfaces, a grounding plane in the substrate, a grounding strip on a side surface of the substrate in electrical communication with the grounding plane, where the grounding strip is electrically connected to the ground plane in the substrate.
    Type: Application
    Filed: April 26, 2019
    Publication date: September 5, 2019
    Applicant: Sentinel Connector Systems, Inc.
    Inventor: Justin Wagner
  • Patent number: 10141698
    Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: November 27, 2018
    Assignee: Sentinel Connector Systems, Inc.
    Inventor: Brett D. Robinson
  • Publication number: 20180233862
    Abstract: A modular connector including a pair of energizable contacts that facilitate an electrical path which may be de-energized by a switch component.
    Type: Application
    Filed: February 9, 2018
    Publication date: August 16, 2018
    Applicant: Sentinel Connector Systems, Inc.
    Inventors: Robert Brennan, Justin Wagner
  • Publication number: 20180205187
    Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.
    Type: Application
    Filed: February 17, 2018
    Publication date: July 19, 2018
    Applicant: Sentinel Connector Systems, Inc.
    Inventors: Brett Robinson, Justin Wagner
  • Publication number: 20180191089
    Abstract: A communication plug including a substrate having a top surface, a bottom surface, opposing side surfaces and opposing end surfaces, a grounding plane in the substrate, a grounding strip on a side surface of the substrate in electrical communication with the grounding plane, where the grounding strip is electrically connected to the ground plane in the substrate.
    Type: Application
    Filed: March 2, 2018
    Publication date: July 5, 2018
    Applicant: Sentinel Connector Systems, Inc.
    Inventor: Justin S. Wagner
  • Patent number: 10014990
    Abstract: A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate and terminating at an end point, a plurality of termination points adjacent to the end points of the pin traces, a plurality of end traces having a height and a width with each end trace extending from an end point of a respective pin trace towards to a corresponding termination point near to the pin trace, a plurality of traces extending from the end of a respective end point or termination point to the edge of the substrate.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: July 3, 2018
    Assignee: Sentinel Connector Systems, Inc.
    Inventor: Brett D. Robinson
  • Publication number: 20180175546
    Abstract: A communication plug including a plug body, a cavity in the plug body, the cavity having a first portion, a second portion and a third portion, a load bar having a plurality of openings on a front face of the load bar, where the cavity is sized to engage the load bar such that the load bar directs at least one wire inserted into a corresponding opening in the load bar into channels in the plug.
    Type: Application
    Filed: February 17, 2018
    Publication date: June 21, 2018
    Applicant: Sentinel Connector Systems, Inc.
    Inventor: Justin Wagner
  • Publication number: 20180175569
    Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias.
    Type: Application
    Filed: February 17, 2018
    Publication date: June 21, 2018
    Applicant: Sentinel Connector Systems, Inc.
    Inventor: Brett Robinson
  • Patent number: 9912448
    Abstract: A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate, a plurality of end traces having a height and a width with each end trace extending from an end of a respective pin trace towards the edge of the substrate, a plurality of branch traces having a height and a width and each extending from a side of a respective pin trace, a plurality of traces extending from the end of a respective end trace, branch trace or pin trace to the edge of the substrate.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: March 6, 2018
    Assignee: Sentinel Connector Systems, Inc.
    Inventor: Brett D. Robinson
  • Patent number: 9912083
    Abstract: A communication plug including a substrate having a top surface, a bottom surface, opposing side surfaces and opposing end surfaces, a grounding plane in the substrate, a grounding strip on a side surface of the substrate in electrical communication with the grounding plane, where the grounding strip is electrically connected to the ground plane in the substrate.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: March 6, 2018
    Assignee: Sentinel Connector Systems, Inc.
    Inventor: Justin S. Wagner
  • Patent number: 9899781
    Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: February 20, 2018
    Assignee: Sentinel Connector Systems, Inc.
    Inventor: Brett Robinson
  • Patent number: 9899765
    Abstract: A communication plug including a plug body, a cavity in the plug body, the cavity having a first portion, a second portion and a third portion, a load bar having a plurality of openings on a front face of the load bar, where the cavity is sized to engage the load bar such that the load bar directs at least one wire inserted into a corresponding opening in the load bar into channels in the plug.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: February 20, 2018
    Assignee: Sentinel Connector Systems, Inc.
    Inventor: Justin Wagner
  • Patent number: 9899776
    Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: February 20, 2018
    Assignee: Sentinel Connector Systems, Inc.
    Inventors: Brett D Robinson, Justin Wagner
  • Patent number: 9653847
    Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: May 16, 2017
    Assignee: SENTINEL CONNECTOR SYSTEM, INC.
    Inventor: Brett Robinson
  • Patent number: 9627816
    Abstract: A method of manufacturing a high speed jack, the method including the steps of forming a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, forming a shielding case surrounding the housing, forming a top layer of a substrate, a first shielding layer on a first side of the top layer in the substrate, a second shielding layer adjacent the first shielding layer in the substrate, and forming a bottom layer adjacent to the second shielding layer, forming a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, forming a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: April 18, 2017
    Assignee: SENTINEL CONNECTOR SYSTEM INC.
    Inventors: Brett D. Robinson, Justin Wagner
  • Patent number: 9337592
    Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug and a shielding case surrounding the housing. A flexible circuit board between the shielding case and the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a first side of the substrate, with each trace extending from a corresponding one of the plurality of vias, and a shielding plane on a second side of the substrate opposite the first side of the substrate.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: May 10, 2016
    Assignee: Sentinel Connector Systems, Inc.
    Inventor: Brett D. Robinson
  • Patent number: 8858266
    Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug and a shielding case surrounding the housing. A flexible circuit board between the shielding case and the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a first side of the substrate, with each trace extending from a corresponding one of the plurality of vias, and a shielding plane on a second side of the substrate opposite the first side of the substrate.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: October 14, 2014
    Assignee: Sentinel Connector Systems, Inc.
    Inventor: Brett D. Robinson
  • Publication number: 20140203820
    Abstract: A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate and terminating at an end point, a plurality of termination points adjacent to the end points of the pin traces, a plurality of end traces having a height and a width with each end trace extending from an end point of a respective pin trace towards to a corresponding termination point near to the pin trace, a plurality of traces extending from the end of a respective end point or termination point to the edge of the substrate, where the end points of each pin trace are adjacent to each other and the termination points are adjacent to one another such that the pair of adjacent end traces and the pair of adjacent termination points are each adjacent to different traces.
    Type: Application
    Filed: March 24, 2014
    Publication date: July 24, 2014
    Applicant: SENTINEL CONNECTOR SYSTEMS, INC.
    Inventor: Brett D. ROBINSON