Abstract: A touch pad for multiple sensing configured to receive touch and pressed-pressure made from at least one finger, conductor or object, comprising an upper conductive layer and a lower conductive layer underneath the upper conductive layer. The upper conductive layer has a plurality of upper sensor members and a plurality of upper joint members. The lower conductive layer has a plurality of lower sensor members and a plurality of lower joint members. The distance-related capacitance on upper sensor members and lower sensor members are detected through the electrically coupled upper joint members and the electrically coupled lower joint members respectively. Besides, an overlapped portion of the upper sensor members and the lower sensor members are electrically conducted by the pressed-pressure.

Abstract: A touch pad for multiple sensing configured to receive touch and pressed-pressure made from at least one finger, conductor or object, comprising an upper conductive layer and a lower conductive layer underneath the upper conductive layer. The upper conductive layer has a plurality of upper sensor members and a plurality of upper joint members. The lower conductive layer has a plurality of lower sensor members and a plurality of lower joint members. The distance-related capacitance on upper sensor members and lower sensor members are detected through the electrically coupled upper joint members and the electrically coupled lower joint members respectively. Besides, an overlapped portion of the upper sensor members and the lower sensor members are electrically conducted by the pressed-pressure.

Abstract: A multi-induced touchpad sequentially includes a protect layer, a first axis locus, an insulation layer, a multi-induced layer, a space dot layer, a conductive film and a substrate. The first axis locus layer has the first axis locus and the multi-induced layer has the second axis locus and a conductive circuit is provided at the first axis locus layer and the multi-induced layer respectively. The respective axis locus is intersected to each other and the conductive circuit is connected to the axis locus respectively for transmitting the conductive inducing signal to a subsequent signal processing component. The second axis locus has an electrical node at an end thereof and the conductive film has an electrical node thereon for connecting with a voltage source and a resistance calculation circuit such that the induced signal at the presses spot can be created and figured out.