Patents Assigned to Seo Won Co., Ltd.
  • Patent number: 7455094
    Abstract: Disclosed therein are apparatus and method for manufacturing agricultural water supply hose, which can continuously supply a small quantity of water to various farm products or agricultural crops such as garden fruits. The apparatus and method can firmly bond the nozzle chips on the hose without regard to materials and constituents of the nozzle chips not by thermally bonding the nozzle chips on the inner periphery of the hose but by bonding the nozzle chips on the inner periphery of the hose after coating the inner periphery of the hose with an adhesive which is supplied from an adhesive coating device, thereby increasing durability. The apparatus and method can prevent distortion of the bonded portion and concentration of stress on the bonded portion even though the coefficients in thermal expansion of the nozzle chips and the hose are different from each other since the bonding between the nozzle chips and the hose is carried out after the hose is sufficiently cooled from a melting point.
    Type: Grant
    Filed: April 18, 2006
    Date of Patent: November 25, 2008
    Assignee: Seo Won Co., Ltd.
    Inventor: Jong-Won Lee
  • Publication number: 20070240785
    Abstract: Disclosed therein are apparatus and method for manufacturing agricultural water supply hose, which can continuously supply a small quantity of water to various farm products or agricultural crops such as garden fruits. The apparatus and method can firmly bond the nozzle chips on the hose without regard to materials and constituents of the nozzle chips not by thermally bonding the nozzle chips on the inner periphery of the hose but by bonding the nozzle chips on the inner periphery of the hose after coating the inner periphery of the hose with an adhesive which is supplied from an adhesive coating device, thereby increasing durability. The apparatus and method can prevent distortion of the bonded portion and concentration of stress on the bonded portion even though the coefficients in thermal expansion of the nozzle chips and the hose are different from each other since the bonding between the nozzle chips and the hose is carried out after the hose is sufficiently cooled from a melting point.
    Type: Application
    Filed: April 18, 2006
    Publication date: October 18, 2007
    Applicant: SEO WON CO., LTD
    Inventor: Jong-Won Lee