Patents Assigned to Sept. 1 Co., Ltd.
  • Patent number: 8552331
    Abstract: A method for producing contact materials being employed in electric/electronic circuits consists of a step 1-1 for supplying a spring base strip 1, a step 2-1 for supplying a noble metal wire 2, a seam welding step 3-1 for welding the metal wire 2 to the spring base strip after the spring base strip 1 and the noble metal wire 2 are held together, and a step 4-1 for winding a welded product. The method further includes a testing step 8-1 for determining a preciseness of a welded position and for determining a welded strength to peel the noble metal wire 2 from the spring base strip 1, which are performed between the seam welding step 3-1 and the winding step 4-1. Specimens for the testing step 8-1 are sampled at the beginning of and at the end of a production lot of the contact material.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: October 8, 2013
    Assignee: Sept. 1 Co., Ltd.
    Inventors: Yoshiaki Kasai, Kiyoshi Takizawa