Patents Assigned to Sequoia Radcure Co., Ltd.
  • Patent number: 8574452
    Abstract: A heat dissipation composition includes a hydroxy function group contained double-bond substance (such as 2-hydroxybenzophenone, 2-hydroxydibenzoacid, and alkyl 2-cyano-3,3-diphenylacrylate) formed of aromatic hydrocarbons having precursor of benzene, which is mixed with a resin-based coating agent and a diluting agent at predetermined ratios for application on a surface of a heat dissipater to facilitate heat dissipation, whereby when the heat dissipater receives heat to be dissipated, the double-bond substance absorbs the heat and induces displacement to form a resonance structure so as to more efficiently dissipate the heat and when the heat is dissipated, the substance restores the double-bond condition thereby realizing improvement of efficiency of heat dissipation.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: November 5, 2013
    Assignee: Sequoia Radcure Co., Ltd.
    Inventor: Ku-Hua Lin