Abstract: A chip packaging structure includes a chip module and a main body, wherein the main body has a first portion, a second portion, and a holding portion. The second portion protrudes from the first portion, and a size of the second portion is less than a size of the first portion. The holding portion is located at the second portion, and the chip module is placed at the holding portion to be engaged with the main body.

Abstract: A chip packaging structure includes a miniature antenna, an radio frequency identification chip, and a packaging member, wherein the radio frequency identification chip is electrically connected to the miniature antenna, and the packaging member is adapted to encapsulate the miniature antenna and the radio frequency identification chip, and has a top surface, a bottom surface, and a plurality of side surfaces, wherein the top surface, the bottom surface, and the side surfaces substantially form a hexahedron.

Abstract: An antenna device includes a substrate, a chip, and an antenna. The chip is disposed on the substrate, and the chip has at least two pads. The antenna is disposed on the substrate, and the chip is disposed between the substrate and the antenna. The antenna has a first bonding line segment and a second bonding line segment electrically connected to the at least two pads respectively. The first bonding line segment is located at an outermost coil of the antenna, and is disposed across a short side direction of the chip in a manner of completely covering one of the at least two pads. The second bonding line segment is located at an innermost coil of the antenna, and is disposed across the short side direction of the chip in a manner of completely covering another of the at least two pads.

Abstract: An antenna device includes a substrate, a chip, and an antenna. The chip is disposed on the substrate, and the chip has at least two pads. The antenna is disposed on the substrate, and the chip is disposed between the substrate and the antenna. The antenna has a first bonding line segment and a second bonding line segment electrically connected to the at least two pads respectively. The first bonding line segment is located at an outermost coil of the antenna, and is disposed across a short side direction of the chip in a manner of completely covering one of the at least two pads. The second bonding line segment is located at an innermost coil of the antenna, and is disposed across the short side direction of the chip in a manner of completely covering another of the at least two pads.

Abstract: A RFID transponder including a chip, having an antenna to which the chip is connected for contactless communication, and including a plastic package (1) which accommodates these transponder components as integrated components, wherein the plastic package (1) forms a coil core (2) on its outer surface, on which a booster antenna having at least one coil winding (4) is arranged, wherein the coil winding (4) completely surrounds the integrated antenna in order to form an inductive coupling, and the two ends (5, 6) of the coil winding (4) form antenna wires of a dipole antenna for the UHF range.

Abstract: Chip card inlay for contact-activated and contactlessly activated chip cards, having a planar substrate layer made of a non-conductive plastics material, on which an antenna having, at its end, planar conductive pads for attaching a chip is fastened, wherein the conductive pads are formed from a textile fabric having thread crossings, and on each top side of the textile fabric an electrically conductive contact zone is provided which has a three-dimensionally conductive terminal pad structure with weave points of the textile fabric as topographical contact zone elevations.

Abstract: Chip card inlay for contact-activated and contactlessly activated chip cards, having a planar substrate layer made of a non-conductive plastics material, on which an antenna having, at its end, planar conductive pads for attaching a chip is fastened, wherein the conductive pads are formed from a textile fabric having thread crossings, and on each top side of the textile fabric an electrically conductive contact zone is provided which has a three-dimensionally conductive terminal pad structure with weave points of the textile fabric as topographical contact zone elevations.

Abstract: A spatial structure having a transponder comprising a planar antenna (6) and a chip (3) connected to the antenna (6), wherein the antenna (6) is at least partially embedded in a planar thermoplastic material (5) of the spatial structure, and a cavity is provided in the thermoplastic material (5) for partial holding the chip (3), wherein a planar module (1) is provided having a non-conducting substrate (2) that cannot be laminated with the thermoplastic material, the chip (3) being able to be connected to said module by way of an electrically conducting film, wherein the film forms contact areas (4a, 4b) for connecting the ends (7, 8) of the antennas (6) to the chip (3) on the module (1), and wherein the thermoplastic material (5) is laminated together with the module (1) and the antenna (6) between two cover layers (9, 10) in sandwich fashion, the contact areas (4a, 4b) of said module being aligned with the ends (7, 8) of the antenna (6).

Abstract: Chip card inlay for contact-activated and contactlessly activated chip cards, having a planar substrate layer made of a non-conductive plastics material, on which an antenna having, at its end, planar conductive pads for attaching a chip is fastened, wherein the conductive pads are formed from a textile fabric having thread crossings, and on each top side of the textile fabric an electrically conductive contact zone is provided which has a three-dimensionally conductive terminal pad structure with weave points of the textile fabric as topographical contact zone elevations.

Abstract: A spatial structure having a transponder comprising a planar antenna (6) and a chip (3) connected to the antenna (6), wherein the antenna (6) is at least partially embedded in a planar thermoplastic material (5) of the spatial structure, and a cavity is provided in the thermoplastic material (5) for partial holding the chip (3), wherein a planar module (1) is provided having a non-conducting substrate (2) that cannot be laminated with the thermoplastic material, the chip (3) being able to be connected to said module by way of an electrically conducting film, wherein the film forms contact areas (4a, 4b) for connecting the ends (7, 8) of the antennas (6) to the chip (3) on the module (1), and wherein the thermoplastic material (5) is laminated together with the module (1) and the antenna (6) between two cover layers (9, 10) in sandwich fashion, the contact areas (4a, 4b) of said module being aligned with the ends (7, 8) of the antenna (6).