Patents Assigned to Setec Netzwerke AG
  • High power data line connection
    Patent number: 6840779
    Abstract: A data line connection which comprises a base printed circuit board, a female connector mounted to the base printed circuit board, and a compensation printed circuit board mounted within the female connector. The compensation printed circuit board mounts a plurality of electrically conductive contact elements as well as a compensation circuit for reducing electrical interference. The base printed circuit board includes a further compensation circuit for further reducing electrical interference.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: January 11, 2005
    Assignee: Setec Netzwerke AG
    Inventors: Andreas Eberle, Franz Neff, Herbert Dauba
  • High power data line connection
    Publication number: 20040203292
    Abstract: A data line connection which comprises a base printed circuit board, a female connector mounted to the base printed circuit board, and a compensation printed circuit board mounted within the female connector. The compensation printed circuit board mounts a plurality of electrically conductive contact elements as well as a compensation circuit for reducing electrical interference. The base printed circuit board includes a further compensation circuit for further reducing electrical interference.
    Type: Application
    Filed: April 28, 2004
    Publication date: October 14, 2004
    Applicant: SETEC NETZWERKE AG
    Inventors: Andreas Eberle, Franz Neff, Herbert Dauba