Patents Assigned to SGS-Antes Componenti Elettronici S.p.A.
  • Process for making single-in-line integrated electronic component
    Patent number: 4711023
    Abstract: Method for making an insulating package premolded on a metallic frame with electrical contacts containing in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface.
    Type: Grant
    Filed: December 15, 1986
    Date of Patent: December 8, 1987
    Assignee: SGS-Antes Componenti Elettronici S.p.A.
    Inventors: Giuseppe Marchisi, Carlo Cognetti De Martiis