Abstract: A testing and finishing system for a discrete or combinational use of apparatus in an automated method of testing, marking, sorting and packing integrated circuit package units is disclosed.The assembly facility comprises:an automated loading machine feeding package units;an environmental test station preceded by an environmental chamber that conditions the units;a transportation means elevating the position of each unit to be processed;an ambient temperature test station;a unit flipper device;a degreasing means;a marking means;a curing means;a lead scanning and straightening mechanism;and an automated binning, buttoning and packing machine.