Abstract: The present invention relates to a flexible ceramic substrate, which is a flexible substrate made of ceramic powder compound. The substrate includes a copper foil substrate having a thickness within a given range to form circuit board wiring through etching. The metal substrate has a surface on which a ceramic compound layer that is formed of a ceramic powder and a gum-like material of a predetermined weight ratio. The gum-like material fills in and wraps crystal gaps of the ceramic powder compound to bond the ceramic powder together to form a flexible ceramic compound layer of a predetermined thickness. The ceramic powder is bonded to the metal substrate to support heat-generating components and conduct and dissipate heat emitting from the heat-generating components.