Abstract: An electronic device and a loudspeaker are provided. The loudspeaker includes: a hollow frame for being connected to the electronic device, a vibration means for producing sound through vibration, a voice coil for driving the vibration means and a magnetic circuit having a magnetic property and arranged at a lower end of an interior of the hollow frame, wherein an end face opening is provided at an upper end of the hollow frame; the vibration means covers the end face opening; one end of the voice coil is connected to the vibration means, and the other end can enter a gap of the magnetic circuit to perform reciprocating motion; the vibration means includes a vibrating diaphragm and a top dome fixedly installed in the middle of the vibrating diaphragm; an outer edge of the vibrating diaphragm is connected to an edge of the end face opening.

Abstract: An electronic device and a loudspeaker are provided. The loudspeaker includes: a hollow frame for being connected to the electronic device, a vibration means for producing sound through vibration, a voice coil for driving the vibration apparatus means and a magnetic circuit having a magnetic property and arranged at a lower end of an interior of the hollow frame, wherein an end face opening is provided at an upper end of the hollow frame; the vibration means covers the end face opening; one end of the voice coil is connected to the vibration means, and the other end can enter a gap of the magnetic circuit to perform reciprocating motion; the vibration means includes a vibrating diaphragm and a top dome fixedly installed in the middle of the vibrating diaphragm; an outer edge of the vibrating diaphragm is connected to an edge of the end face opening.

Abstract: The present invention provides a directional MEMS microphone and a receiver device wherein MEMS microphone comprises a microphone cover, a printed circuit board (PCB), a application specific integrated circuit (ASIC) chip, a MEMS die, a diaphragm, a damping, a metal wire(s), at least two internal acoustic ports and at least two external acoustic ports corresponding to the internal acoustic ports. The microphone further comprises a tuning cavity which includes a first tuning cavity by which a first internal acoustic port is communicated with a first external acoustic port, or by which a second internal acoustic port is communicated with a second external acoustic port. Compared with the prior art, the directional MEMS microphone including the tuning cavity to form a sound transmission channel by connecting the internal acoustic port and the external acoustic port expands the sound transmission distance, thereby increasing the sensitivity the directivity of the MEMS microphone.

Abstract: The present invention provides a directional MEMS microphone and a receiver device wherein MEMS microphone comprises a microphone cover, a printed circuit board (PCB), a application specific integrated circuit (ASIC) chip, a MEMS die, a diaphragm, a damping, a metal wire(s), at least two internal acoustic ports and at least two external acoustic ports corresponding to the internal acoustic ports. The microphone further comprises a tuning cavity which includes a first tuning cavity by which a first internal acoustic port is communicated with a first external acoustic port, or by which a second internal acoustic port is communicated with a second external acoustic port. Compared with the prior art, the directional MEMS microphone including the tuning cavity to form a sound transmission channel by connecting the internal acoustic port and the external acoustic port expands the sound transmission distance, thereby increasing the sensitivity the directivity of the MEMS microphone.

Abstract: The present invention relates to a directional MEMS microphone which comprises a cover, a printed circuit board, a sound inlet structure, an integrated circuit chip which is attached to the printed circuit board, and a MEMS die which is attached to the printed circuit board. The cover provides an open side where the printed circuit board and the cover are coupled. The sound inlet structure comprises a main sound port which is disposed on the printed circuit board and communicated with the inner cavity of the MEMS die and a secondary sound port which is communicated with the inner cavity of the cover. The MEMS microphone of the present invention features with directional receiving function, simple structure and convenient application.

Abstract: Various embodiments of a silicon microphone sensing element without dedicated backplate are disclosed. The microphone sensing element has a circular or polygonal diaphragm with a plurality of perforated springs suspended above the front side of a conductive substrate. The diaphragm is aligned above one or more back holes in the substrate having a front opening smaller than the diaphragm. In one embodiment, a continuous perforated spring surrounds the diaphragm and has a shape that conforms to the diaphragm. A plurality of perforated beams connects the spring to rigid pads that anchor the movable diaphragm and spring. In another embodiment, there is a plurality of perforated springs having double or triple folding configurations and a plurality of perforated beams connecting the diaphragm to rigid pads. Also disclosed is a scheme to integrate the silicon microphone sensing element with CMOS devices on a single chip.

Abstract: The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, the spacer, and the mounting substrate and accessed by the opening. Electrical connections are made between the one or more transducer chips and the mounting substrate and/or between the one or more transducer chips and the top cover. A bottom cover can be mounted on a bottom surface of the mounting substrate wherein a hollow chamber is formed between the mounting substrate and the bottom cover, wherein a second opening in the bottom cover is not aligned with the first opening. Pads on outside surfaces of the top and bottom covers can be used for further attachment to printed circuit boards. The top and bottom covers can be a flexible printed circuit board folded under the mounting substrate.

Abstract: A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm is surrounded by a circular spring having a plurality of slots and perforations to facilitate air damping reduction, release of in-plane stress, and improve out-plane flexibility. Anchored at a substrate, the circular spring holds the silicon microphone suspended over a backside hole in the substrate but allows the diaphragm to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of “n” bonding pads near the outer edge of the circular spring are connected by “n/2” bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact.

Abstract: A silicon based microphone sensing element and a method for making the same are disclosed. The microphone sensing element has a diaphragm with adjoining perforated plates on the front side of a conductive substrate. The diaphragm is aligned above a back hole in the substrate wherein the front opening of the back hole is smaller than the diaphragm. The diaphragm is supported by mechanical springs each having one end attached to the diaphragm and another end connected to a rigid pad anchored on a dielectric spacer. The diaphragm, perforated plates, and mechanical springs are preferably made of the same film and are suspended above an air gap that overlies the substrate. A first electrode is formed on one or more rigid pads and a second electrode is formed at one or more locations on the substrate to establish a variable capacitor circuit. Different embodiments are shown that reduce parasitic capacitance.

Abstract: The MEMS package comprises a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery. The first and second pre-molded lead-frame substrates are interconnected with metal leads. At least one MEMS device is attached to one of the substrates. The first pre-molded lead-frame substrate is folded over and joined to the second pre-molded lead-frame substrate to house the at least one MEMS device. In one embodiment, the first pre-molded lead-frame substrate has metal leads extending outside of sidewalls of the cavities. The extended metal leads are folded over the top of the second pre-molded lead-frame substrate to form surface mounting pads. In some embodiments, extended metal leads are folded along the sidewalls and connected to ground for electromagnetic interference (EMI) shielding.

Abstract: A Micro Electro Mechanical Systems (MEMS) G-switch includes one or more actuators formed between fixed driving stages and moveable driving stages. A proof mass is attached to the moveable driving stages and flexibly attached to a substrate through one or more spring members. A voltage control circuit applies working voltages to the driving stages. With a first working voltage applied between the moveable and the fixed driving stages, moving of the driving stages' sensing direction towards gravity at a first critical angle will cause moveable driving stages to collapse and touch the fixed driving stage on the substrate and thus turn on the MEMS G-switch. After turning on the G-switch, a second working voltage is applied and moving of the driving stages' sensing direction away from gravity at a second critical angle will cause moveable electrodes to deviate from the fixed electrodes and thus turn off the MEMS G-switch.

Abstract: The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, the spacer, and the mounting substrate and accessed by the opening. Electrical connections are made between the one or more transducer chips and the mounting substrate and/or between the one or more transducer chips and the top cover. A bottom cover can be mounted on a bottom surface of the mounting substrate wherein a hollow chamber is formed between the mounting substrate and the bottom cover, wherein a second opening in the bottom cover is not aligned with the first opening. Pads on outside surfaces of the top and bottom covers can be used for further attachment to printed circuit boards. The top and bottom covers can be a flexible printed circuit board folded under the mounting substrate.

Abstract: Improved impact proof capability of a silicon microphone sensing element is achieved with a stopper element that limits the maximum vibration of moveable parts. The stopper has a lower anchor portion and upper finger portion that is elevated a certain distance above the diaphragm and overhangs the outer edges of the perforated plates. The stopper is formed on a stack consisting of a lower substrate, a middle dielectric layer, and an upper membrane layer. There is a back hole in the substrate and an air gap in the dielectric layer to allow sound to impinge on the diaphragm. The number of fingers and composition of the stopper is variable. Optionally, the stopper has a center support design and is formed on a center anchor within an opening in the diaphragm. An upper finger region overhangs the diaphragm near the center opening and thereby prevents breakage due to large vibrations.