• Publication number: 20210284528
    Abstract: This present disclosure provides a microstructure and a method for manufacturing the same. The method includes: disposing a liquid film on a surface of a substrate, wherein a solid-liquid interface is formed where the liquid film is in contact with the substrate; and irradiating the substrate with a laser of a predetermined waveband to etch the substrate at the solid-liquid interface, wherein the position where the laser is irradiated on the solid-liquid interface moves at least along a direction parallel to the surface of the substrate, and the absorption rate of the liquid film for the laser is greater than the absorption rate of the substrate for the laser.
    Type: Application
    Filed: March 4, 2021
    Publication date: September 16, 2021
    Applicant: Shanghai Industrial ?Technology Research Institute
    Inventor: SHINAN WANG
  • Patent number: 10290795
    Abstract: The present disclosure provides a packaging method and a semiconductor device, the packaging method comprising: depositing a first sacrificial layer on a substrate to cover a semiconductor element formed on the substrate; covering a first dielectric layer on an upper surface and a side wall of the first sacrificial layer, the first dielectric layer has a first groove exposing part of the first sacrificial layer; covering a second sacrificial layer on surface of the exposed first sacrificial layer; covering a second dielectric layer on the second sacrificial layer and the exposed surface of the first dielectric layer, the second dielectric layer having a releasing hole exposing the second sacrificial layer and a second groove; depositing a filling layer to fill the second groove; by the releasing hole, removing the second sacrificial layer and the first sacrificial layer to form a cavity; depositing a third dielectric layer which covers the exposed surface of the second dielectric layer, and filling the releas
    Type: Grant
    Filed: October 10, 2015
    Date of Patent: May 14, 2019
    Inventors: Yue Fei, Xuhong Wang, Ying Zhang