Abstract: The application discloses a POL integrated power supply module and a production process thereof. The POL integrated power supply module comprises an inductor assembly, a substrate, a switch unit and an input capacitor. The substrate comprises a first surface and a second surface which are opposite, the inductor assembly is arranged on the second surface of the substrate, and the switch unit and the input capacitor are arranged on the first surface of the substrate. According to the POL integrated power supply module, a structural layout is provided, and the ultrathin thickness of the POL integrated power supply module is achieved. According to the POL integrated power supply module with the structure, a corresponding production process is provided, the production process is simplified, and the reliability of the POL integrated power supply module is improved.

Abstract: The application discloses a wafer-level power module and a manufacturing method thereof. The wafer-level power module comprises a wafer and a passive element, the wafer comprises a wafer functional area, and the wafer functional area is located on the first surface of the wafer; the passive element comprises at least one power pin, the passive element is stacked on the second surface of the wafer, the wafer functional area is electrically connected to the second surface of the wafer from the first surface of the wafer through a conductive path and is electrically connected with the power pin of the passive element, and the conductive path is attached to the wafer.

Abstract: The invention provides a power supply module with high heat dissipation capability and high reliability. Aiming at the problem that when a power supply module and a system board are fixedly welded, internal welding spots are remelted due to high temperature, on one hand, the structure of the power supply module is further optimized, a device layer is formed in a device in the power supply module through plastic packaging or embedded, an insulating dielectric layer is arranged between the two adjacent device layers, and the device layer and the insulating medium are laminated into an assembly body; the metal interconnection layer is arranged on the surface of the assembly body, and electrical connection between devices in the power supply module is achieved; and no metal welding spot exists in the power supply module, and the assembly reliability of the power supply module and the system is improved.

Abstract: A high-heat-dissipation high-frequency power module including an embedded circuit board, at least two semiconductor power devices, at least one high-frequency capacitor, and an insulating heat-conducting material is provided. Power electrodes of the at least two semiconductor power devices are connected in series to form at least one power conversion bridge arm. A ratio of the area of the overlapping projections of the power electrodes' wiring of the semiconductor power devices led out from the surface of the embedded circuit board, and the area of the semiconductor power devices is 60% or more. A power conversion bridge arm is connected in parallel to the high-frequency capacitor nearby so as to realize a low-loop inductance interconnection.

Abstract: A high-frequency high-power density module power supply including a carrier element is provided. At least one surface of the carrier element is provided with a surface power pin, and a flexible and rigid combination assembly. The flexible and rigid combination assembly comprises at least one rigid part and at least one flexible part, the at least one rigid part comprises a power semiconductor assembly, and the rigid part is electrically connected to the flexible part. At least one part of the flexible and rigid combination assembly is electrically connected to the surface power pin of the carrier element. The flexible and rigid combination assembly is bent by using the surface of the carrier element as a carrier. The rigid part and the flexible part are connected by means of the same flexible component.

Abstract: A power conversion device is provided. The power conversion device is applied to a circuit topology and layout of the six-switch flying capacitor voltage reduction type conversion circuit which is applied to the intermediate bus converter. The layout of the transformer and the inductor is provided, so that the parasitic resistance of the winding in the magnetic core assembly is minimum. An auxiliary switch and an auxiliary winding are additionally arranged on the six-switch flying capacitor voltage reduction type conversion circuit, and the auxiliary switch and the auxiliary winding are used for providing enough energy for the output end when the input voltage is lower than four times of the output voltage. A switch layout is provided to reduce parasitic parameters and power losses of a transformer winding AC loop, and parasitic parameters and power losses on the switch bridge arm path.

Abstract: A high-integration-level carrier plate includes at least two prefabricated printed circuit board lamination layers, at least one hollowed-out area is formed in the printed circuit board lamination layer, the hollowed-out areas are embedded in the carrier plate, the printed circuit board lamination layers are fixedly connected through an insulating bonding dielectric layer and are electrically connected through at least one bonding material piece, and at least one power supply circuit assembly is arranged in the hollowed-out area; the printed circuit board lamination layer comprises at least a part of windings, and the windings and the magnetic cores are used for forming magnetic elements in the power supply circuit assembly through mutual cooperation.

Abstract: A power conversion device and a magnetic assembly are provided. The power conversion device and the magnetic assembly are applied to a circuit topology aiming at the application of an input voltage to an output voltage high-voltage-reduction ratio. The circuit topology has low switching loss and high conversion efficiency in a high-frequency switching occasion of a power switch. The device layout setting of the power conversion device and the winding mode of the transformer are provided, the size of the power conversion device is reduced, and the steady-state performance and the dynamic performance of the conversion device are improved.

Abstract: A high-integration carrier plate and a manufacturing method thereof are disclosed. The carrier plate is configured for a power supply module, the carrier plate includes at least one hollowed-out area, an inductance element is arranged in the hollowed-out area, the inductance element comprises a magnetic core and a winding penetrating through the magnetic core, at least one part of a side wall of the hollowed-out area is provided with a side wall metal piece, the at least one side wall metal piece is used for being electrically connected with one electrostatic potential end of the power supply module, and the inductance element is fixedly connected with the side wall of the hollowed-out area through an insulating bonding medium layer.

Abstract: The application discloses an inductance assembly and an integrated power converter module. An inductance assembly is arranged on a bottom substrate, after integral plastic packaging, a signal electrical connecting piece is formed on the plastic packaging material through electroplating, and the signal electrical connector extends from the top surface of the inductance assembly to the side surface of the plastic packaging material and then extends to the bottom surface of the bottom substrate. The auxiliary winding is added to the second aspect to be coupled with the main winding to form a TLVR inductor for improving the dynamic performance of the VRM module. The VIN electrical connector is arranged between the main winding and the signal electrical connector, the middle portion of the VIN electrical connector is widened, and the transmission signal on the hopping signal interference signal electrical connector of the main winding is effectively avoided.

Abstract: A high-frequency high-power packaging module comprises at least one power conversion bridge arm, at least one high-frequency capacitor, a circuit layer, an insulating heat-conducting plate, and a plastic package body. The front surface of the semiconductor power device is electrically connected with the first surface of the circuit layer, and the back surface of the semiconductor power device is thermally connected with or electrically connected with the lower surface of the insulating heat-conducting plate. The high-frequency capacitor is electrically connected with the first surface of the circuit layer or the second surface of the circuit layer or the lower surface of the insulating heat-conducting plate, and at least one electrode of the high-frequency capacitor is electrically connected with at least one electrode of the at least one semiconductor power device through the inner-layer electric connection layer.

Abstract: According to the six-switch flying capacitor voltage buck-type conversion circuit and the four-switch flying capacitor voltage buck-type conversion circuit applied to the intermediate bus converter, further optimization is provided. On one hand, a power conversion device is provided, the voltage peak of the switch is absorbed by optimizing the clamping circuit and the layout thereof, the voltage stress of the switch is reduced, no extra loss is generated, and the conversion efficiency of the power conversion device is improved. On the other hand, by optimizing the current sampling circuit, the monitoring and control performance related to the current is optimized, and the size of the power conversion device is reduced.

Abstract: The application discloses a power conversion device. The power conversion device comprises a transformer assembly, a switch, an output capacitor and a driving unit, and the conversion efficiency of the power conversion device is optimized; On the other hand, the application discloses a layout of the power conversion device; The layout comprises a transformer area, a switch area, an output capacitor area and a port area layout, and the conversion efficiency of the power conversion device is further improved through reasonable layout; and on the other hand, the application discloses a current sampling scheme suitable for the power conversion device is disclosed, and a control pin is multiplexed in a time-sharing mode, so that comprehensive detection and monitoring of the current of the power conversion device and the current sharing function of the plurality of power conversion devices in parallel application are achieved.

Abstract: The application discloses an anti-driving interference power module which comprises at least one half-bridge power module. The half-bridge power module comprises a first switch device, a second switch device, a DC positive terminal and a DC negative terminal. The DC positive terminal, the first switch device, the second switch device and the DC negative terminal form a filtering loop which is the same as the second driving loop of the second switch device. According to the application, through the coupling design of the detour direction of the circuit, the driving crosstalk generated by the gate is inhibited for the device which does not need to be turned on, and mistaken opening of driving is avoided; and for the device needing to be opened, the turn-on level driven by the gate is enhanced, so that the reliability of the power module is higher.

Abstract: The application discloses an ANPC power module. at least one power module, wherein the power module comprises six switch assemblies, a DC end, a GND end and an SW end, the six switch assemblies comprise two outer switches, two inner switches and two clamping switches, wherein an additional capacitor lead-out terminal is arranged at an electrical connection of each of the two inner switches and the two switch bridge arms, the capacitor lead-out terminal is used for setting a high-frequency filter capacitor, and two ends of the high-frequency filter capacitor are electrically connected with the capacitor lead-out terminals corresponding to the two switch bridge arms respectively. The application can effectively improve the instantaneous dynamic voltage spike of the high-frequency switching action, improve the oscillation frequency, increase the working voltage range of the device, and prevent the EMI noise from interference the devices outside of the ANPC power module.

Abstract: An integrated assembly and an integrated power converter module are disclosed. The integrated assembly includes an inductor assembly and a first capacitor assembly. The top surface of the integrated assembly is provided with an upper surface pin, and the bottom surface is provided with a lower surface pin; the inductor assembly includes a magnetic core and a main winding penetrating through the magnetic core from the top surface to the bottom surface thereof, the main winding is electrically connected with the upper and the lower surface pins, the surface of the magnetic core is provided with a capacitor setting area where the first capacitor assembly is arranged; the bottom surface of the electrode of the first capacitor assembly and the pin of the lower surface of the inductor assembly are coplanar, and the top surface of the first capacitor assembly and the surface of the magnetic core are electrically isolated.

Abstract: An ultra-thin voltage regulator module with high current density and an inductor assembly are described. The ultra-thin voltage regulator module comprising at least one inductor assembly, at least one top assembly and a power electrical connection assembly, wherein the inductor assembly is a 2N-phase ultra-thin inductor; the inductor assembly comprises a magnetic core and an inductor winding; the shape of the inductor winding is specifically I-shaped; the power electrical connection assembly comprises a first power electrical connector and a second power electrical connector; the top assembly comprises a top plate and an IPM unit, and the SW end of the IPM unit is perpendicular to the position of the inductor winding.

Abstract: A power conversion circuit and a magnetic assembly are provided. The magnetic assembly comprises a transformer magnetic core, an inductance magnetic core, a first winding and a second winding, and discloses a winding method of the first winding and the second winding. On the other hand, an auxiliary power supply circuit is provided. When the output voltage of the power conversion circuit does not reach the steady-state working voltage or the power conversion circuit is in a standby state, power supply is provided for the MCU and the power management bus. On the other hand, the application provides a power switch VDS voltage clamping protection circuit suitable for a power conversion circuit. The application of the small-size compact power conversion device can be realized, the loss of the power conversion device is reduced, and the conversion efficiency is improved.

Abstract: A power conversion circuit and a power conversion device are provided. In the power conversion circuit, the upper switch, the middle switch and the lower switch form a three-switch bridge arm; By controlling the duty ratio of the upper switch, the gain ratio of the required input voltage to the output voltage is realized; On the other hand, the layout of the power conversion device is disclosed, and the layout of the power conversion device comprises the layout of a transformer area, a switch area, an inductance area and components. A driving power supply scheme which is used for realizing driving power supply of the three-switch bridge arm. A pre-charging unit which is used for pre-charging the flying capacitor before the power conversion device is started, and the instantaneous impact current generated when the switch in the power conversion circuit is turned on is reduced.

Abstract: A magnetic assembly is provided. The magnetic assembly comprises a magnetic core and two winding combinations. The magnetic core comprises a middle column, two side columns and two magnetic substrates. The middle column and the two side columns are arranged between the two magnetic substrates, and the middle column is arranged between the two side columns. The two winding combinations are respectively wound on one side column, each winding combination comprises two windings which are connected with each other. The voltage at the two ends of one winding wound on one side column is 90 degrees out of phase with the voltage of the two ends of one winding wound on the other side column.