Abstract: A method for wafer thinning process to decrease the failure rate on split gate NOR flash product of the present invention, wherein comprising the following step: a method for wafer thinning process to decrease the failure rate on Split gate NOR flash product, characterized in that including the following steps: Step 1, place the wafer on the chuck and face up the side which needs to grind; Step 2, fix the wafer on the chuck; Step 3, grind the side of wafer which needs to be grinded by a grinding wheel, said grinding wheel and said chuck rotate at the same time during the grinding process; Step 4, clean up the surface of the wafer when the process of grinding is end; Step 5, enter the next process directly without polishing the wafer which has already complete the grinding process.