Abstract: An image defect detection apparatus includes: an image acquisition section for acquiring an image as image data; a check section for checking for the presence or absence of a defect in the image, the defect being of one of a plurality of different types. The check section includes: a matrix setting subsection for setting, within the acquired image, an inspection reference region and an inspection region in accordance with each type of defect; a comparison value extraction subsection for extracting a comparison value based on image data in the inspection reference region and image data in the inspection region as set by the matrix setting subsection; and a comparison subsection for determining the presence or absence of the defect based on a comparison between the comparison value extracted by the comparison value extraction subsection and a predetermined threshold value.

Abstract: A semiconductor chip pickup apparatus of the present invention includes an aspiration section and an aspiration unit connected to the aspiration section, in which the aspiration unit includes a stage for mounting the semiconductor chip thereon and an adhesive sheet is attached to the semiconductor chip between the stage and the semiconductor chip, the stage includes undulations in at least a part of an area in which the semiconductor chip is mounted, and by operating the aspiration section, a suction force is applied to at least a part of an area in which the undulations are formed.