Abstract: Provided are a preparation method for a power module component, and a power module component. The surface of the component is flat, which can improve the welding accuracy and reduce the contact resistance of the power module components, leading to a higher reliability. The circuits and pins are on the surface of the component, without additional volume, which reduces the volume of the component and improves the power density of the power module. In addition, the power module component provided by an example of the present application is prepared by integrated molding; the gaps among various elements are fully filled, so that the inductance and magnetic flux density of the product can be improved. Moreover, the power module component can have a very small volume, thus increasing the power density of the power module to make the power supply smaller in volume.