Abstract: A water-cooling heat dissipation device includes a water cooling head, a delivering structure, a water-cooling radiator, and a water pump. The water-cooling head includes a chamber. The delivering structure is disposed on the water-cooling head and includes a water delivery column. The water delivery column includes a first and a second water passages. The first and second water passages are connected to the chamber. Multiple first and second slot holes are disposed on the first and second water passages respectively. The water-cooling radiator includes multiple tubes. A window is formed in the water-cooling radiator by splitting each tube. The water delivery column inserts in the window. Each first and second slot holes are welded to the nozzles of the tubes.

Abstract: A liquid cooling device includes a water tank structure having parallel and separated first and second water tanks. The heat dissipation structure is installed between the first and second water tanks and the three are coupled to each other to form a curved cooling water passage. A mounting portion is formed in the gap between the heat dissipation structure and the first and second water tanks in the extension direction of the heat dissipation structure and the first and second water tanks. Both of the pumping structure and the endothermic structure are coupled to the first and second water tanks. The pumping structure and the endothermic structure are installed in at least one mounting portion and the pumping structure drives a working fluid to flow back and forth between the first water tank, the heat dissipation structure and the second water tank in the curved cooling water passage sequentially.

Abstract: A fluid cooling device includes an endothermic cover, an endothermic base and a fluid pump. The endothermic cover has a port; and a heat exchange chamber formed between the longitudinally affixed endothermic base and endothermic cover, and a heat exchange unit installed in the heat exchange chamber. The fluid pump includes a pump housing and a driving element, and the pump housing has a pump space and a coupling tube communicating to each other. A vane of a driving element is received in the pump space, and the coupling tube is longitudinally plugged into the port and seamlessly combined and fixed to each other, and the pump housing maintains an insulation gap with the endothermic cover through the coupling tube. Therefore, the heat of the heat sink will not be conducted to the fluid pump and no seam is produced and thus no waterproof gasket is needed.

Abstract: A heat sink provides a pump body, a pump cover, a pump module, a guide plate and a water block. The pump body is an integrally formed shell seat and forms a first chamber, a second chamber and an insulation gap. The pump cover covers the first chamber. The guide plate is combined in the second chamber and forms a heat exchange chamber. The water block includes a bottom plate and fins. The bottom plate covers the heat exchange chamber, and the fins are disposed in the heat exchange chamber. Therefore, the heat can be prevented from being transferred from the water block to the pump module.

Abstract: A liquid cooling device includes a water tank structure having parallel and separated first and second water tanks. The heat dissipation structure is installed between the first and second water tanks and the three are coupled to each other to form a curved cooling water passage. A mounting portion is formed in the gap between the heat dissipation structure and the first and second water tanks in the extension direction of the heat dissipation structure and the first and second water tanks. Both of the pumping structure and the endothermic structure are coupled to the first and second water tanks. The pumping structure and the endothermic structure are installed in at least one mounting portion and the pumping structure drives a working fluid to flow back and forth between the first water tank, the heat dissipation structure and the second water tank in the curved cooling water passage sequentially.

Abstract: Disclosed is a liquid cooling radiation system. The technical solution used by the present invention to solve the technical problem is: the liquid cooling radiation system comprises: a radiation device, comprising cooling pipes and a radiation structure device arranged on the cooling pipes; a pumping device, integrally arranged between the cooling pipes and generating power so that a coolant circulates within the cooling pipes; a heat absorption device, attached to a heating device and having a heat conduction effect with the heating device; a pipeline, used for connecting the radiation device and the heat absorption device. On the basis of existing products, the present invention utilises a solution wherein a liquid pump main body and a radiator are integrally arranged together. Thus, the radiation of a fan is used to take away heat on the radiator and heat generated by a pump power main body (i.e. a motor) itself is also taken away, thereby extending the service life of the motor.