Abstract: A luminaire that includes a lamp shell, a sealing strip assembly, a light-transmitting panel, a light source assembly, and a pair of end covers respectively fixed to the lamp shell to restrict the light source assembly, the light-transmitting panel, and the sealing strip assembly from protruding from the lamp shell. The lamp shell includes an installation cavity having an opening formed at a front side, an inner wall of the installation cavity being provided with an upper embedding groove and a lower embedding groove corresponding to each other at a position adjacent to the opening. The light-transmitting panel includes an upper end and a lower end respectively embedded in the upper embedding groove and the lower embedding groove, and which are abutted against an inner wall of the upper embedding groove and an inner wall of the lower embedding groove by the sealing strip assembly.

Abstract: The present disclosure relates to a lamp comprising a PCB board and an integrated heat dissipation device, wherein the PCB board is a double-sided PCB board on both sides of which are suitable for installing LED lamp beads, the PCB board has two heat dissipation edges arranged relatively to each other, the integrated heat dissipation device comprises a heat sink and two heat dissipation arms, wherein the heat dissipation arms and the heat sink are integrally formed with the medium, and the two heat dissipation arms are respectively fitted snugly with the two heat dissipation edges. The lamp provided by the present disclosure is assembled with a double-sided PCB board and an integrated heat dissipation device to improve the integration degree of the PCB board and the heat sink.

Abstract: An automobile LED headlamp, comprising a stem, an LED module and a heat dissipation module, wherein, the LED module is mounted on the stem; the heat dissipation module comprises a fixing element and a plurality of heat dissipation strips, the fixing element is fixedly connected to one end of the stem, each of the heat dissipation strips is fixed to the fixing element, and each of the heat dissipation strips is distributed radially. The arrangement of the heat dissipation module is configured to enhance the heat dissipation capability, each heat dissipation strip is fixed on the fixing element in a annular and radial distribution, the heat dissipation area is maximized, the air convection speed is faster, and the heat dissipation is accelerated.