Abstract: A clamp includes a base, a limiting member, a positioning assembly, and a pressing assembly. The base defines a gap. The limiting member defines a limiting slot corresponding to the gap. The positioning assembly is positioned at a first side of the limiting member. The positioning assembly includes a positioning handle and a pushing member. The pushing member extends in the limiting slot, and the positioning handle runs through the limiting member and is connected to the pushing member. The pressing assembly is positioned at a second side opposite to the first side. The pressing assembly runs through the limiting member and extends in the limiting slot. A chip is capable of being pushed to the position of the gap by the pushing member with operating the positioning handle and resists against the pressing assembly, thus being clamped. The present disclosure also provides a mounting method using the clamp.

Abstract: The present invention provides a semiconductor laser package including a heat sink, a laser bar with a plurality of lasers on the heat sink, an insulated layer arranged between said heat sink and said laser bar, a solder layer combining said insulated layer with said laser bar, and a clearance crossing said solder layer defined between adjacent lasers.