Abstract: Disclosed are a thermal crosslink material, a manufacture method of a liquid crystal display panel, and a liquid crystal display panel. A structural formula of the thermal crosslink material is wherein A is B is and R is a linear or chain branched alkyl having 5-20 C atoms, wherein one or more CH2 in the alkyl is substituted with phenyl, cycloalkyl, —O—, —CONH—, —COO—, —O—CO—, —CO—, or —CH?CH— group, or one or more H atoms in the first group are substituted with F atom or Cl atom; a specific crosslink material may be one of Molecules of the thermal crosslink material crosslink together to form a polymer having a crosslinked network, and groups A and B can be anchored on a substrate surface. The branch R provides an effect of vertical alignment and can form alignment films.

Abstract: A curved backlight assembly includes a light source, a curved light guide plate (LGP), a heat-dissipating plate, a supporting plate and a connecting member. The light source is abutted with the curved LGP. The heat-dissipating plate and supporting plate are connected by the connecting member to thereby form a curved backplane. The curved LGP is arranged on the curved backplane. Connected ends of the heat-dissipating plate and supporting plate are formed with elongated slots. The connecting member penetrates through elongated slots to connect the heat-dissipating plate and the supporting plate. A dimension of the curved backplane is increased or decreased with a relative displacement between the heat-dissipating plate and supporting plate to match with expansion or contraction of the curved LGP. The present invention has a simple structure. An optical coupling distance between the light source and curved LGP is shortened and the light incidence efficiency is improved.

Abstract: The present invention discloses an LED structure and a manufacturing method thereof. The LED structure has a housing, an LED chip and a transparent encapsulant. The housing has a recess and at least one protruded wall. The LED chip is received in the recess. The transparent encapsulant is formed by dispensing a molding compound into the recess by an adhesive dispenser. The transparent encapsulant has an edge matched with an edge of the recess to encapsulate the LED chip in the recess, and has a height smaller than that of the protruded wall. The LED chip of the LED structure of the present invention can emit light through the spherical surface of the transparent encapsulant based on a greater visual angle, and thus enhance the light extraction efficiency.