Patents Assigned to Shenzhen Fitech Co., Ltd.
  • Micro/nano particle reinforced composite solder and preparation method therefor
    Patent number: 11325210
    Abstract: A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: May 10, 2022
    Assignee: Shenzhen Fitech Co., Ltd.
    Inventors: Pu Xu, Siyuan Wang, Daoke Yu, Kui Chen, Jianhao Shi
  • MICRO/NANO PARTICLE REINFORCED COMPOSITE SOLDER AND PREPARATION METHOD THEREFOR
    Publication number: 20200001406
    Abstract: A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C.
    Type: Application
    Filed: December 7, 2017
    Publication date: January 2, 2020
    Applicant: Shenzhen Fitech Co., Ltd.
    Inventors: Pu XU, Siyuan WANG, Daoke YU, Kui CHEN, Jainhao SHI