Abstract: The present application relates to a substrate, an LED light source assembly and manufacturing methods therefor. The substrate includes a first substrate and a second substrate which are arranged in a stacked manner. Electrode soldering regions on the front side of the first substrate and corresponding first conductive regions on the back side of the first substrate are electrically connected; and second conductive regions on the front side of the second substrate and corresponding third conductive regions on the back side of the second substrate are electrically connected, where the corresponding first conductive regions and the corresponding second conductive regions are electrically connected.

Abstract: An optical semiconductor element mounting package as well as an optical semiconductor device using the package are provided. The optical semiconductor element mounting package has a recessed part that serves as an optical semiconductor element mounting region. The package includes a resin molding and at least a pair of positive and negative lead electrodes. The resin molding is composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part. The lead electrodes are disposed opposite to each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

Abstract: Provided are an LED support, a lamp bead and a manufacturing method thereof, a conductive base, and a light-emitting unit module. An LED chip of the lamp bead can be directly disposed on a metal pad of the conductive base, and heat generated thereby can be directly dissipated outward through the metal pad. An exposed solder pad is provided at each of a lower surface and a first side surface of the metal pad for external electrical connection.

Abstract: An LED device, an LED backlight module, and a display are provided. The LED backlight module includes an LED light plate, a diffusion plate, and an optical film. The LED light plate includes a driving circuit, a substrate, and LED devices on the substrate. The LED device includes a transparent LED frame, an LED chip disposed on a bottom portion of the transparent LED frame, and a packaging glue layer formed inside the transparent LED frame and covering the LED chip. A diffusion agent is distributed in the packaging glue layer. The optical film includes a brightening film, an MOP film, and a QBEF film. According to the LED device, with the transparent LED frame and the packaging glue layer containing the diffusion agent, the LED device can provide wide-angle and uniform illumination.

Abstract: A flip LED chip module and a method for manufacturing LED chip module are provided. In the manufactured flip LED chip module, the second glue layer for reducing light energy is formed on the front surface of each of the flip LED chips. Therefore, the difference between the light intensity of the light along the normal direction of the flip LED chip and the light intensity of the light at the four sides of the flip LED chip can be reduced, thus improving the uniformity of the color of the light. Hence, the color of the light of the LED device manufactured by the LED chip module can be more uniform, thus improving the quality of the LED device and the user satisfaction.

Abstract: A light emitting device includes a resin package and at least one light emitting element. The resin package includes a resin molding and at least one lead electrode. The at least one light emitting element is disposed on a main face of the at least one lead electrode. A rear face of the at least one lead electrode is not in contact with the resin molding. There is no gap at a joint face between the resin molding and the at least one lead electrode. A composition of the resin molding includes a white pigment having a particle size from 0.1 ?m to 50 ?m.

Abstract: A method of manufacturing a light emitting device includes disposing at least one light emitting element on a recessed part of a resin package. The resin package having the recessed part includes a resin molding with a white pigment having a particle size from 0.1 ?m to 50 ?m and at least one lead electrode. The resin molding is disposed on a portion of a main face of the at least one lead electrode and is not in contact with a rear face of the at least one lead electrode. There is no gap at a joint face between the resin molding and the at least one lead electrode. The at least one light emitting element is disposed on the main face of the at least one lead electrode.

Abstract: An optical semiconductor element mounting package as well as an optical semiconductor device using the package are provided. The package has a recessed part served as an optical semiconductor element mounting region. The package includes a resin molding and at least two lead electrodes. The resin molding is composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part. The lead electrodes are disposed opposite to and spaced apart from each other, and at least a portion of main faces of the lead electrodes forms a part of the bottom face of the recessed part. The main face of the lead electrode and a side face of the lead electrode are built up to an angle, the side face of the lead electrode is non-linear, and there is no gap at a joint face between the resin molding and the lead electrodes.

Abstract: A method of manufacturing an optical semiconductor device includes disposing an optical semiconductor element on a recessed part of an optical semiconductor element mounting package. The package includes at least two lead electrodes and a thermosetting epoxy resin composition. The lead electrodes are disposed opposite to and spaced apart from each other. Each lead electrode has a top surface, a bottom surface, and a side wall. The lead electrodes are not bent. The thermosetting epoxy resin composition forms a molded part disposed on at least a portion of the top surfaces of the lead electrodes and disposed at a region between the lead electrodes. The molded part together with a portion of each of the lead electrodes form a recessed part for disposing at least an optical semiconductor element. At least one of the side walls of the lead electrodes is not a straight line.

Abstract: An optical semiconductor element mounting package as well as an optical semiconductor device using the package are provided. The optical semiconductor element mounting package has a recessed part that serves as an optical semiconductor element mounting region. The package includes a resin molding and at least a pair of positive and negative lead electrodes. The resin molding is composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part. The lead electrodes are disposed opposite to each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

Abstract: An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

Abstract: A packaging method of high color gamut white light quantum dot (QD) light emitting diodes (LEDs). The method includes: a. add an organic solvent to red light QD phosphor powder and blue light QD phosphor powder, respectively; b. perform ultrasonic processing for the solutions; c. prepare a mixed QD solution; d. add mixed packaging glue to the mixed QD solution; e. remove the organic solvent; f. add green light rare earth phosphor powder; g. drip the mixed phosphor glue into an LED stent fixed with ultraviolet chips, and bake and solidify the LED stent to obtain LED beads. The method produces high gamut white light LEDs and greatly improves the color gamut value of LED backlight beads, which reaches above NTSC 92%. With an organic solvent as a connecting bridge, QDs and the packaging glue are mixed uniformly, QD phosphor powder failure resulted from agglomeration is avoided, and quality of high color gamut white light LED beads is significantly improved.

Abstract: A packaging method of high color gamut white light quantum dot (QD) light emitting diodes (LEDs). The method includes: a. add an organic solvent to red light QD phosphor powder and blue light QD phosphor powder, respectively; b. perform ultrasonic processing for the solutions; c. prepare a mixed QD solution; d. add mixed packaging glue to the mixed QD solution; e. remove the organic solvent; f. add green light rare earth phosphor powder; g. drip the mixed phosphor glue into an LED stent fixed with ultraviolet chips, and bake and solidify the LED stent to obtain LED beads. The method produces high gamut white light LEDs and greatly improves the color gamut value of LED backlight beads, which reaches above NTSC 92%. With an organic solvent as a connecting bridge, QDs and the packaging glue are mixed uniformly, QD phosphor powder failure resulted from agglomeration is avoided, and quality of high color gamut white light LED beads is significantly improved.