Patents Assigned to SHENZHEN MEES HI-TECH CO., LTD.
  • Patent number: 10893355
    Abstract: The earphone comprises a main housing; a cover; a speaker module; a circuit module; and a power supply. The cover is buckled on the main housing. The speaker module, the circuit module, and the power supply are disposed within a space enclosed by the main housing and the cover. The speaker electrical connector is used to achieve an electrical connection between the speaker body and the circuit module in an elastic contact manner. The battery electrical connector is used to achieve electrical connection with the circuit board in the elastic contact manner.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: January 12, 2021
    Assignee: SHENZHEN MEES HI-TECH CO., LTD.
    Inventor: Yuanqing Huang