Abstract: The present disclosure provides a manufacturing method for an LED substrate and the LED substrate, the manufacturing method for the LED substrate includes following steps: S1: preparing a carrier substrate, disposing riveting points on preset positions of the carrier substrate; S2: sintering conductive lines on the carrier substrate, and covering an outer periphery of each riveting point with connecting ends of the conductive lines; and S3: riveting terminal pins to the riveting points, combining the terminal pins with the carrier substrate, and forming a conductive connection between the terminal pins and the connecting ends of the conductive lines. Compared with a traditional manufacturing method of the LED substrate, in a manufacturing process, steps of silver paste spot coating, silver paste high-temperature sintering and the like are reduced.