Abstract: An IC test device includes a test circuit board and a test fixture. The fixture includes an interposer, a test socket, and a fastener. A protrusion is formed at a bottom face of the interposer, and a space is formed besides the protrusion. A plurality of first contacts is formed at the bottom of the protrusion for soldering with corresponding pads of the test circuit board. A plurality of second contacts is formed on a top face of the interposer and electrically connected to the first contacts. The socket defines a guide groove for receiving an IC. A plurality of conductors are arranged corresponding to the guide groove and extend through the test socket. Each conductor has a bottom end electrically connected to one corresponding second contact and a top end for contacting a pin of the IC. The fastener is mounted on the test socket to press the IC.