Abstract: An integrated package method for MEMS element and ASIC chip includes forming a re-layout layer on a front surface of an ASIC wafer; coating an organic compound layer on the re-layout layer and applying a lithography process to the organic compound layer to from a microcavity array; aligning and bonding an electrode connection pad layer on a front surface of an MEMS element with the microcavity array to form a closed cavity structure; thinning and exposing a silicon substrate on a back surface of the MEMS element to a desired thickness; applying the lithographic process on the MEMS element to expose the electrode connection pad layer and an electrical contact area of the re-layout layer; and manufacturing a metal connection member connected to the electrode connection pad layer and the electrical contact area. An integrated package structure for MEMS element and ASIC chip is also provided.

Abstract: Disclosed are a detection method for static image of a video, a detection terminal, and a computer-readable storage medium. The method includes: obtaining a frame image from the video as a reference frame image in a playback order, obtaining an image set comprising n frame images after the reference frame image in the playback order; sequentially determining whether first (n?1) frame images in the currently obtained image set satisfy a preset static image brightness requirement; determining whether a nth frame image in the image set satisfies a preset gray histogram judgment condition; determining whether a stop condition is satisfied according to the reference frame image and the nth frame image in the currently obtained image set; if the above determination results are yes, determining that a video image including the frame images from the reference frame image to the nth frame image in the current image set is a static image.

Abstract: An optimization method for UAV-based wireless information and energy transmission includes following steps: S1: reporting, by a wireless device, an energy state of the wireless device to a UAV; S2: detecting, by the UAV, a channel state between the UAV and the wireless device; and S3: selecting, by the UAV, an optimal action based on estimated revenue maximization according to an electric quantity of the UAV, an electric quantity of the wireless device, and the channel state. The use of the wireless device can reduce wiring costs, beautify the space, and ensure a smaller size and a lower power. By applying the UAV to information and energy transmission for the wireless devices, the data transmission rate and the energy conversion efficiency of networks are improved.

Abstract: Embodiments of the present disclosure provide a pixel arrangement structure, a display panel, and a display device. The pixel arrangement structure includes at least one repeating pixel group, wherein each of the at least one repeating pixel group includes a first pixel unit, a second pixel unit, a third pixel unit, and a fourth pixel unit. Two sub-pixels of the first pixel unit are adjacent to two sub-pixels of the second pixel unit, and two sub-pixels of the third pixel unit are adjacent to two sub-pixels of the fourth pixel unit, thereby achieving pixel multiplexing.

Abstract: An electromagnetic induction type coordinate positioning apparatus is provided. The apparatus includes a first induction coil, a second induction coil, a trigger circuit, and a control circuit. The first induction coil is flowed through a first current signal, and the first induction coil is configured to sense a pointer device when the electromagnetic induction type coordinate positioning apparatus is in a sleep mode, and generate a first induction signal when detecting the pointer device. The second induction coil is flowed through a second current signal, and the first induction coil is configured to sense and communicate with the pointer device when in an operating mode. The trigger circuit sends an interrupt signal according to the first induction signal. The control circuit interrupts the sleep mode according to the interrupt signal and switches to the operating mode. The control circuit in the operating mode controls the second control signal to flow through the second induction coil.

Abstract: Embodiments of this disclosure include a data processing method. In the method, a training sample set that includes a plurality of graph computing task training samples is obtained. At least one performance indicator feature of each of the graph computing task training samples is extracted. The at least one performance indicator feature includes one or more of a graph data feature, a graph processing platform feature, a graph algorithm feature, and a machine hardware feature. A target performance prediction model is generated based on a mapping relationship between actual execution times of the graph computing task training samples and the performance indicator features. According to at least one performance indicator feature of an inputted graph computing task test sample, a predicted execution time of the graph computing task test sample is output based on the target performance prediction model.

Abstract: A touch screen and a touch display device are provided. Since a concave region of a cover is recessed into a chamber to form a recess portion, a space occupied by the chamber is reduced, thereby reducing a hollow feeling caused by the chamber and reducing a spatial instability of the chamber. In addition, a sealant prevents moisture, dust, and the like from entering the chamber.

Abstract: A package structure includes an inner wiring layer, a first dielectric layer, a first outer wiring layer, and an electronic component assembly. The first dielectric layer includes a first surface and a second surface facing away from the first surface. The inner wiring layer and the electronic component assembly are embedded into the first dielectric layer from the first surface. The first outer wiring layer is disposed on the second surface. The electronic component assembly includes a first electronic element and a second electronic element. The second electronic element is disposed close to the second surface, and an electrical connector of the second electronic element faces the second surface. The first electronic element is disposed on a side of the second electronic element facing away from the second surface, and exposed from the first surface. The first outer wiring layer electrically connects the electrical connector of the second electronic element and the inner wiring layer, respectively.

Abstract: An optical semiconductor element mounting package as well as an optical semiconductor device using the package are provided. The package has a recessed part served as an optical semiconductor element mounting region. The package includes a resin molding and at least two lead electrodes. The resin molding is composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part. The lead electrodes are disposed opposite to and spaced apart from each other, and at least a portion of main faces of the lead electrodes forms a part of the bottom face of the recessed part. The main face of the lead electrode and a side face of the lead electrode are built up to an angle, the side face of the lead electrode is non-linear, and there is no gap at a joint face between the resin molding and the lead electrodes.

Abstract: A neural network model training method and apparatus, a computer device, and a storage medium are provided. The method includes: obtaining a model prediction value of each of all reference samples based on a trained deep neural network model, calculating a difference measurement index between the model prediction value of each reference sample and a real annotation corresponding to the reference sample, and using a target reference sample whose difference measurement index is less than or equal to a preset threshold as a comparison sample; using a training sample whose similarity with the comparison sample meets a preset augmentation condition as a to-be-augmented sample; and performing data augmentation on the to-be-augmented sample, and using the obtained target training sample as a training sample to train the trained deep neural network model until model prediction values of all verification samples in a verification set meet a preset training ending condition.

Abstract: Provided are a speaker unit and a speaker device. A main body of the speaker unit is a rectangular bowl-shaped structure, and comprises a suspension system, a magnetic circuit system having an annular magnetic gap, and a bowl-shaped frame connecting the suspension system and the magnetic circuit system. The bowl-shaped frame accommodates the suspension system and the magnetic circuit system. The magnetic circuit system is fixed to the interior of the bowl-shaped frame. The suspension system comprises a diaphragm and at least one voice coil connected to a bottom portion of the diaphragm. The magnetic circuit system comprises at least one magnetic circuit assembly matching the voice coil. One end of the voice coil is connected to the diaphragm by means of a voice coil frame. The other end of the voice coil is suspended within an annular magnetic gap of the magnetic circuit assembly.

Abstract: An array substrate, a method of manufacturing thereof, and a display panel are provided. In the array substrate, a lesser thickness of an active layer in a GOA area achieves improved response time of thin film transistor in the GOA area, and a greater thickness of the active layer in a display area reduces diffusion of photons in the active layer, so as to decrease an influence of negative bias of thin film transistor in the display area. Additionally, different demands for characteristics of the array substrate in the display area and in the GOA area may be met, such that quality of the display panel may be improved.

Abstract: An array substrate and a display device are disclosed. The array substrate includes a substrate, a first gate line, a second gate line, via holes, and a first metal line. By providing the via holes in a non-display area, a pixel space in a display area occupied by the via holes can be prevented, which is beneficial to increase storage capacitance of the pixel, and the capacitance being increased takes up about 25% of the storage capacitance of the pixel. There is no need to change original internal design of the pixel, causing little influence on internal design space of the pixel, being adapted to high PPI pixel design, simple in pixel design, easy to be implemented, and universally compatible.

Abstract: An image acquisition device includes: a main body structure provided with an image acquisition means and at least two accommodating structures, the at least two accommodating structures including a first accommodating structure configured to place a first target object and a second accommodating structure configured to place a second target object, where the first accommodating structure is arranged at a first position of the main body structure, the first position satisfying the condition that the first target object placed on the first accommodating structure is located within acquisition area coverage of the image acquisition means; and the second accommodating structure is arranged at a second position of the main body structure, the second position satisfying the condition that the second target object placed on the second accommodating structure is located within the acquisition area coverage of the image acquisition means.

Abstract: A method of manufacturing an optical semiconductor device includes disposing an optical semiconductor element on a recessed part of an optical semiconductor element mounting package. The package includes at least two lead electrodes and a thermosetting epoxy resin composition. The lead electrodes are disposed opposite to and spaced apart from each other. Each lead electrode has a top surface, a bottom surface, and a side wall. The lead electrodes are not bent. The thermosetting epoxy resin composition forms a molded part disposed on at least a portion of the top surfaces of the lead electrodes and disposed at a region between the lead electrodes. The molded part together with a portion of each of the lead electrodes form a recessed part for disposing at least an optical semiconductor element. At least one of the side walls of the lead electrodes is not a straight line.

Abstract: A photographic equipment stand includes a support frame, a pan-tilt head and a first cold shoe. The support frame includes a fixed base and a support leg. One end of the support leg is rotatably fixed to the bottom of the fixed base, and the support leg can be placed vertically. The pan-tilt head is detachably arranged on the top of the fixed base, and the photographic equipment can be mounted on the top of the pan-tilt head. The pan-tilt head comprises a pan-tilt head base. The pan-tilt head base is detachably arranged on a top of the fixed base. The pan-tilt head connector comprises a first connection end and a second connection end. The first connection end passes through the pan-tilt head tray and is provided with an external thread. The second connection end is rotatably connected to the pan-tilt head base.

Abstract: A character recommendation method and apparatus, a computer device, and a storage medium are disclosed. The method includes: converting code inputted in a code input interface into a syntax tree, the syntax tree including a plurality of nodes, a hierarchical relationship between the plurality of nodes, and location intervals of the plurality of nodes; determining, according to a cursor location in the code input interface and the syntax tree, at least one reference node corresponding to the cursor location in the syntax tree; parsing the at least one reference node, and determining a to-be-recommended target character according to a parsing result; and recommending the target character in the code input interface.

Abstract: The present application discloses an audio device that has an inhibitory effect on sound waves emitted by a near-field sound source within a specified range and has an amplification effect on sound waves emitted from a far-field sound source outside the specified range. The audio device includes a first sound wave sensor to receive a sound wave and output a first signal based on the sound wave; a second sound wave sensor to receive the sound wave and output a second signal based on the sound wave; and a signal processing circuit coupled to the first sound wave sensor and the second sound wave sensor to generate an output signal based on the first signal and the second signal, wherein the audio device's near-field sensitivity to a sound wave is substantially lower than its far-field sensitivity to the sound wave.