Patents Assigned to SHENZHENSHI HUANWEI WOODS CO., LTD.
  • Publication number: 20180134001
    Abstract: Two-ply solid composite wood component comprises a solid wood substrate, The solid wood substrate includes two groups of horizontal grained cores, a vertical grained core and two vertical grained frames. The vertical grained core is fixed between the two groups of horizontal grained cores, such that the two groups of horizontal grained cores are supported by stress. Since the horizontal grained cores are supported by the vertical grained frames, the two groups of horizontal grained cores are not easily warped, such that the two-ply solid composite wood component has more excellent resistance to bending, deformation and warping.
    Type: Application
    Filed: March 7, 2017
    Publication date: May 17, 2018
    Applicant: SHENZHENSHI HUANWEI WOODS CO.,LTD
    Inventor: Dawei Li
  • Patent number: 9382718
    Abstract: The present invention relates to engineered wood flooring with a double-frame substrate. The engineered wood flooring comprises a double-frame substrate of wood and a solid wood panel adhered to the double-frame substrate. The double-frame substrate of wood comprises a horizontal grain core and two vertical grain frames; two vertical grain frames are bonded on both sides of the horizontal grain core along the grain direction of the core; the horizontal grain core is sandwiched in the middle, and the horizontal grain core and the vertical grain frame are perpendicular to each other and located in the same plane; the vertical grain frame on each side comprises two vertical grain boards, and one vertical wood board is located between the horizontal grain core and the other vertical wood board. The engineered wood flooring has excellent resistance of deformation, small deformation, high strength and steady usage.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: July 5, 2016
    Assignee: SHENZHENSHI HUANWEI WOODS CO., LTD.
    Inventor: David Li