Patents Assigned to Shibaura Mechantronics Corporation
  • Publication number: 20150090298
    Abstract: In a substrate processing device 10, a magnetic field forming unit is added to a solvent supply unit 58. The magnetic field forming unit 100 applies a magnetic field to a surface of a substrate W on which a cleaning liquid and a volatile solvent coexist. The magnetic field forming unit stirs and mixes the cleaning liquid and the volatile solvent on the surface of the substrate W to promote replacement of the cleaning liquid with the volatile solvent.
    Type: Application
    Filed: September 24, 2014
    Publication date: April 2, 2015
    Applicant: SHIBAURA MECHANTRONICS CORPORATION
    Inventors: Yuji NAGASHIMA, Jun MATSUSHITA, Yuki SAITO, Konosuke HAYASHI, Kunihiro MIYAZAKI
  • Publication number: 20050056215
    Abstract: An applying apparatus, which applies paste in a preset pattern to a substrate, includes a stage having a holding surface on which the substrate is placed, a beam member extending above the stage in a direction along the holding surface, a moving device which relatively moves the beam member and the stage in a direction along the holding surface and perpendicular to the extending direction of the beam member, a guide member provided on the beam member and along the extending direction of the beam member, an applying head which is supported by the guide member and movable along the guide member, and a plurality of suction nozzles which are provided along the guide member and suck air in the vicinity of the guide member.
    Type: Application
    Filed: March 4, 2004
    Publication date: March 17, 2005
    Applicant: Shibaura Mechantronics Corporation
    Inventor: Noriaki Shimoda
  • Publication number: 20040182696
    Abstract: A sputtering power-supply unit comprises a voltage generation section which generates a sputtering voltage between a negative electrode output terminal and a positive electrode output terminal, and a circuit section which reduces fluctuation in a sputtering current even if an arc discharge occurs between the negative electrode output terminal and the positive electrode output terminal. Thus, fluctuation in the sputtering current can be reduced even if the arc discharge occurs between the negative electrode output terminal and the positive electrode output terminal.
    Type: Application
    Filed: March 15, 2004
    Publication date: September 23, 2004
    Applicant: Shibaura Mechantronics Corporation
    Inventors: Noboru Kuriyama, Kazuhiko Imagawa
  • Publication number: 20040177923
    Abstract: In a method of detecting arc discharge in a glow-discharge apparatus GD that has a high-frequency power source PS, a cutting pulse is output for time T1 to the high-frequency power source PS to stop a supply of power to the glow-discharge apparatus GD, when dVr/dt−dVf/dt increases over a first level, where Vf and Vr are a traveling-wave voltage and a reflected-wave voltage applied to the glow-discharge apparatus GD, respectively. Arc discharge is determined to have developed in the glow-discharge apparatus, when Vr/Vf increases to a second level or a higher level within a preset time To after the supply of power to the glow-discharge apparatus is stopped.
    Type: Application
    Filed: March 17, 2004
    Publication date: September 16, 2004
    Applicant: Shibaura Mechantronics Corporation
    Inventor: Noboru Kuriyama