Patents Assigned to Shibaura Mechatronics Corporation of Kanagawa
  • Substrate processing method and processing apparatus
    Patent number: 6374834
    Abstract: This invention provides a cleaning method of cleaning a laser mark formed on a semiconductor wafer. A semiconductor wafer is rotated in a circumferential direction, and a laser mark is detected indirectly or directly in a non-contact manner. Rotation of the semiconductor wafer is controlled on the basis of detection of the laser mark, and an ultrasonic vibration-applied processing solution is sprayed to the laser mark.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: April 23, 2002
    Assignees: Shin-Etsu Handotai Co., Ltd., Shibaura Mechatronics Corporation of Kanagawa
    Inventors: Tatsuo Abe, Tsutomu Doi