Patents Assigned to Shielding For Electronics, Inc.
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Publication number: 20050202174Abstract: Apparatus and methods for coating a substrate. In an exemplary embodiment, the apparatus are used to create a metallized substrate for use as an EMI/RFI shield. The apparatus typically includes a movable processing apparatus that is movable orthogonal to the substrate to treat the substrate. The processing apparatus can include a surface preparation assembly, a heating assembly, a thermoforming assembly, a metallizing assembly, a cutting assembly, or the like.Type: ApplicationFiled: December 13, 2004Publication date: September 15, 2005Applicants: Wavezero, Inc., Shielding for Electronics, Inc.Inventor: Rocky Arnold
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Publication number: 20050202723Abstract: The present invention provides in-line equipment and methods for manufacturing an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield may comprise a shaped thermoform shell that has one or more conductive layers applied to one or more surfaces. The EMI/RFI shield may be integrally formed with the formable sheet via attachment tabs that are positioned along one or more edges of the EMI/RFI shield.Type: ApplicationFiled: February 17, 2005Publication date: September 15, 2005Applicants: Wavezero, Inc., Shielding for Electronics, Inc.Inventors: Rocky Arnold, John Zarganis
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Publication number: 20040234752Abstract: Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be deposited onto the substrate and/or metal layer.Type: ApplicationFiled: June 7, 2004Publication date: November 25, 2004Applicants: Wavezero, Inc., Shielding for Electronics, Inc.Inventors: Rocky R. Arnold, John Zarganis, Steve Toyama
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Publication number: 20040187311Abstract: The present invention provides cables having a body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.Type: ApplicationFiled: October 21, 2003Publication date: September 30, 2004Applicant: Shielding for Electronics, Inc.Inventors: Jesus Al Ortiz, Rocky R. Arnold
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Publication number: 20040120131Abstract: The present invention provides in-line equipment and methods for manufacturing an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield may comprise a shaped thermoform shell that has one or more conductive layers applied to one or more surfaces. The EMI/RFI shield may be integrally formed with the formable sheet via attachment tabs that are positioned along one or more edges of the EMI/RFI shield.Type: ApplicationFiled: September 17, 2003Publication date: June 24, 2004Applicant: Shielding for Electronics, Inc.Inventors: Rocky R. Arnold, John C. Zarganis
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Patent number: 6643918Abstract: The present invention provides methods for shielding a cable that comprises a plurality of conductive leads that are encapsulated by a dielectric substrate. One embodiment of the method comprises applying a metallized layer around the dielectric substrate and coupling a metallized thermoform shield around an end of the metallized dielectric substrate and conductive leads so as to create a conductive connection between the metallized thermoform shield and the metallized layer on the dielectric substrate.Type: GrantFiled: February 16, 2001Date of Patent: November 11, 2003Assignee: Shielding for Electronics, Inc.Inventors: Jesus Al Ortiz, Rocky R. Arnold
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Patent number: 6624353Abstract: An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.Type: GrantFiled: December 7, 2000Date of Patent: September 23, 2003Assignee: Shielding for Electronics, Inc.Inventor: John F. Gabower
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Patent number: 6624432Abstract: An EMI and RFI shield mounting system includes a compartmented EMI shield constructed of a vacuum metallized thermoform having upright hollow walls separating and surrounding the compartments. The shield conforms to the interior of a housing for electronic equipment, with the upright walls overlying ridges formed in the interior of the housing. A compressible gasket is placed between the ridges of the housing and the inner reaches of the hollow walls of the shield. The free sides of the walls of the shield may be abutted against ground traces on a printed circuit board on which the shield and housing are placed. The gasket urges the metallized free edges of the walls of the shield against the ground trace of the printed circuit board to provide electrical conductivity between the printed circuit board and the shield. Dimples, tabs or protruding punctures may be formed in the free sides of the walls to ensure conductive contact with the ground trace.Type: GrantFiled: October 6, 2000Date of Patent: September 23, 2003Assignee: Shielding for Electronics, Inc.Inventors: John F. Gabower, Louis Sylvester Hughes
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Patent number: 6570085Abstract: An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.Type: GrantFiled: October 29, 1997Date of Patent: May 27, 2003Assignee: Shielding For Electronics, Inc.Inventor: John F. Gabower
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Publication number: 20030085050Abstract: The present invention provides electromagnetic interference filters and gaskets. In exemplary embodiments, the filters and gaskets are made from conductively coated reticulated foam having a pore density varying from 10 to 40 pores per inch (PPI). The filters can be used to cover ventilation openings in an electronics enclosure to shield electrical components, equipment and devices from EMI, electrostatic discharge (ESD) and radio frequency interference (RFI) while still providing adequate airflow to enter and cool the system. The filter material may also help prevent dust and dirt from entering the enclosure. The filters of the present invention are also well suited to conductively bridge gaps between mating features of electronic enclosures. The reticulated foam to fabricate the filters allow for excellent compression (generally 20%-50% of the original thickness) under low compressive forces, while easily recovering from the compressive load without noticeable compression set (permanent deflection).Type: ApplicationFiled: August 28, 2002Publication date: May 8, 2003Applicant: Shielding for Electronics, Inc.Inventors: John C. Zarganis, Rocky R. Arnold, John F. Gabower
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Publication number: 20020071940Abstract: Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be deposited onto the substrate and/or metal layer.Type: ApplicationFiled: September 4, 2001Publication date: June 13, 2002Applicant: Shielding for Electronics, Inc.Inventors: Rocky R. Arnold, John Zarganis, Steve Toyoma
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Publication number: 20010040043Abstract: The present invention provides cables having a body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.Type: ApplicationFiled: February 16, 2001Publication date: November 15, 2001Applicant: SHIELDING FOR ELECTRONICS, INC.Inventors: Jesus Al Ortiz, Rocky R. Arnold
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Publication number: 20010033478Abstract: The present invention provides a vacuum deposited metal layer that can shield the electronic components on a PCB or FPC. The vacuum metallized conductive layer can be grounded to a ground trace on the circuit board to create a Faraday cage to protect the electronic components disposed on the circuit board from EMI. The metallized conductive layer can be disposed over an encapsulating insulative layer or onto a shaped thermoform or mold injected plastic substrate that is coupled to the PCB or FPC.Type: ApplicationFiled: February 16, 2001Publication date: October 25, 2001Applicant: SHIELDING FOR ELECTRONICS, INC.Inventors: Jesus Al Ortiz, Rocky R. Arnold