Abstract: An epoxy resin composition comprising an epoxy resin, either 2-vinyl-4,6-diamino-s-triazine or 2-vinyl-4,6-diamino-s-triazine/isocyanuric acid adduct, and at least one compound selected from dicyandiamide, polyvinyl-p-phenol and specific imidazole compounds. The composition is useful, for example, in inks, insulating paints and adhesives for printed circuit base boards and in copper-clad laminated boards.