Abstract: Problem: To provide a microwave aging device that can shorten the time required for ageing food and can improve a yield rate. Solution: There is provided a microwave aging device including: a microwave aging unit 30, having an aging chamber configured to store food, an irradiation port through which microwave irradiation is performed into the aging chamber, and a blower fan configured to blow air into the aging chamber; a cooling unit 10 having a cooling chamber that is cooled by a cooler; a microwave oscillating unit 20 connected to the irradiation port; and a controller 40, where the aging chamber is arranged in the cooling chamber. There is also provided a microwave aging method using the device.

Abstract: A culture system and a culture device each can minimize the burden on workers and can effectively prevent the effect of temperature changes on culture by performing manipulation of a multilayer culture vessel and the culture in sequence in the same space. The culture system comprises a housing with an internal space in which a multilayer culture vessel including a plurality of trays therein is placed, and a manipulator manipulating the multilayer culture vessel while the multilayer culture vessel is kept in a state placed within the internal space. The multilayer culture vessel is communicated with a liquid supply tube such that a fluid material can be introduced into the multilayer culture vessel from an outside of the housing via the liquid supply tube, or that a fluid can be discharged from the multilayer culture vessel to the outside of the housing via the liquid supply tube.

Abstract: A multi-layer culture vessel operation system capable of easily performing a multi-layer culture vessel handling operation is provided.

Abstract: A multi-layer culture vessel observation system, a cart device, and a multi-layer culture vessel observation device that enable an operator to easily observe objects to be observed in a multi-layer culture vessel are provided.

Abstract: Problem: To provide a microwave aging device that can shorten the time required for ageing food and can improve a yield rate. Solution: There is provided a microwave aging device including: a microwave aging unit 30, having an aging chamber configured to store food, an irradiation port through which microwave irradiation is performed into the aging chamber, and a blower fan configured to blow air into the aging chamber; a cooling unit 10 having a cooling chamber that is cooled by a cooler; a microwave oscillating unit 20 connected to the irradiation port; and a controller 40, where the aging chamber is arranged in the cooling chamber. There is also provided a microwave aging method using the device.

Abstract: A semiconductor device includes an electrical insulating layer with superior heat resistance, heat dissipation, and durability, and which is manufactured through a process with good cost performance and process performance. In a semiconductor device including a first substrate to which a semiconductor chip is mounted directly or indirectly, and a white insulating layer formed on a surface of the first substrate and functioning as a reflecting material, the semiconductor chip is an LED, at least the surface of the first substrate is made of a metal, and a stacked structure of the white insulating layer and a metal layer is formed by coating a liquid material, which contains SiO2 in the form of nanoparticles and a white inorganic pigment, over the surface of the first substrate and baking the coated liquid material.

Abstract: An LED illumination module in which LED bare chips are mounted on a mounting substrate at a high density, the module comprising many LED bare chips having the same specifications, the mounting substrate at least a surface of which is metal, and a reflection region in which the LED bare chips are sealed off with resin, wherein a surface of the reflection region of the mounting substrate is covered with an inorganic white insulating layer that functions as a reflection member, a unit LED chip group including a plurality of LED bare chips connected in series is disposed plural, the plural unit LED chip groups being connected in parallel, overall light flux is 10,000 lumens or more, and a mounting area density of the LED bare chips in the reflection region is 15 mm2/cm2 or more. An LED illumination apparatus including the LED illumination module is also provided.

Abstract: An LED illumination module in which LED bare chips are mounted on a mounting substrate at a high density, the module comprising many LED bare chips having the same specifications, the mounting substrate at least a surface of which is metal, and a reflection region in which the LED bare chips are sealed off with resin, wherein a surface of the reflection region of the mounting substrate is covered with an inorganic white insulating layer that functions as a reflection member, a unit LED chip group including a plurality of LED bare chips connected in series is disposed plural, the plural unit LED chip groups being connected in parallel, overall light flux is 10,000 lumens or more, and a mounting area density of the LED bare chips in the reflection region is 15 mm2/cm2 or more. An LED illumination apparatus including the LED illumination module is also provided.

Abstract: A semiconductor device includes an electrical insulating layer with superior heat resistance, heat dissipation, and durability, and which is manufactured through a process with good cost performance and process performance. In a semiconductor device including a first substrate to which a semiconductor chip is mounted directly or indirectly, and a white insulating layer formed on a surface of the first substrate and functioning as a reflecting material, the semiconductor chip is an LED, at least the surface of the first substrate is made of a metal, and a stacked structure of the white insulating layer and a metal layer is formed by coating a liquid material, which contains SiO2 in the form of nanoparticles and a white inorganic pigment, over the surface of the first substrate and baking the coated liquid material.

Abstract: A system for autonomous decentralized control in which a client terminal and a center server are connected, as a network through a WAN and/or LAN, to a remote control server connected to a monitored/-controlled target device through a control communication network. The system is characterized in that a virtual machine, which is described as the other self of the monitored/controlled target device having the same information as that possessed by the monitored/controlled target device, and which is a software object having communication protocols used for communication with the monitored/controlled target device and concealed in the software object, is moved in the system with transparency and/or is held in the client terminal, the center server, or the remote control server.

Abstract: The present invention relates to a microwave chemical reaction apparatus characterized by comprising a means for heating a reaction liquid, which is capable of irradiating microwaves while controlling the output power according to the temperature of the reaction liquid, together with a means for forcibly cooling the reaction liquid from the outside, and being capable of precisely controlling the reaction temperature. The microwave chemical reaction apparatus can control the reaction temperature precisely, for example, within ±1° C. of a predetermined temperature, and can be applied to fine chemical reactions. Further, since reactions proceed rapidly in such an apparatus, mass production can be achieved by a relatively small-sized reaction apparatus.

Abstract: A lead frame having a die pad of such a shape that prevents scattering of solder to lead when a chip is mounted on the lead frame, and a semiconductor device using such a lead frame are provided. The lead frame includes a die pad having a region surrounded by a first side, a second side opposing to the first side, a third side different from the first and second sides, and a fourth side opposing to the third side, and a lead formed of a conductor and electrically connected to a semiconductor element. The die pad includes a notch extending along the first and the second sides and positioned opposing to a main surface of the semiconductor element, and a through hole extending along the third and fourth sides and positioned opposing to the main surface of the semiconductor element. The semiconductor device employs the die pad.

Abstract: Components such as an earth plate, a gas introduction ring, and the like placed in a reaction chamber in a plasma apparatus are made of aluminum containing magnesium in a concentration of 2.2 to 2.8% by weight and are not coated with alumite. In addition, a heater incorporated in a section of the reaction chamber heats the section during a plasma cleaning process. Further, an electrical discharge chamber is also incorporated in the plasma apparatus for providing a plasma to the reaction chamber for efficient plasma cleaning of the apparatus.