Patents Assigned to Shin Wha Products Co., Ltd.
  • Patent number: 6235385
    Abstract: An electrically conductive adhesive tape used for electrical and electronic products to bond or fix an element to a support while maintaining an electrical conductibility between the element and support. The conductive adhesive tape has a structure including a resin film, a metal layer formed over one surface of the resin film by depositing a conductive metal over the surface of the resin film, and a conductive adhesive layer coated over the metal layer. The metal layer has a net-shaped structure. In some cases, the metal layer may have a planar structure. The conductive adhesive tape has a very small thickness by virtue of its metal layer deposited to a very small thickness. Accordingly, the conductive adhesive tape maintains a desired strength while exhibiting a high flexibility and a high bondability, thereby exhibiting a superior conductibility. In the case in which the metal layer has a net-shaped structure, the tape has a structure having spaces where the metal layer does not exist.
    Type: Grant
    Filed: February 22, 1999
    Date of Patent: May 22, 2001
    Assignee: Shin Wha Products Co., Ltd.
    Inventor: Yong-In Lee