Patents Assigned to SHINHAN DIAMOND IND. CO., LTD.
  • Patent number: 10632552
    Abstract: A saw blade is provided having a noise and stress-reduction structure, the saw blade having a structure in which a plurality of diamond segments are mounted at a first unit and the first unit has a second unit, thereby reducing the noise generated during a cutting operation, while increasing heating performance with a relatively simple configuration, and simultaneously dispersing impact stress so as to prevent the occurrence of cracks.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: April 28, 2020
    Assignee: SHINHAN DIAMOND IND. CO., LTD.
    Inventor: Shin kyung Kim
  • Patent number: 9764442
    Abstract: There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: September 19, 2017
    Assignees: Insstek, Inc., Shinhan Diamond Ind. Co., Ltd.
    Inventor: Jeong-Hun Suh
  • Patent number: 9238277
    Abstract: There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.
    Type: Grant
    Filed: September 6, 2010
    Date of Patent: January 19, 2016
    Assignees: INSSTEK, INC., SHINHAN DIAMOND IND, CO., LTD
    Inventor: Jeong-Hun Suh
  • Publication number: 20130225052
    Abstract: Provided is a chemical mechanical polishing pad conditioner including a substrate including a plurality of protrusions formed on at least one surface thereof and made of ceramic or hard metal alloy. The plurality of protrusions may be formed through laser processing so as not to have angled edges on an upper end and an inclined side thereof. The chemical mechanical polishing pad conditioner further includes a diamond thin film deposited so as to cover the plurality of protrusions, wherein the diamond thin film includes a rough polishing surface on which micro protrusions having a size of several ?m are formed.
    Type: Application
    Filed: August 11, 2011
    Publication date: August 29, 2013
    Applicant: SHINHAN DIAMOND IND. CO., LTD.
    Inventors: Jun Ho Song, Mun Seak Park, Shin Kyung Kim, Young Hwan Kim, Hyun Woo Lee
  • Publication number: 20110053479
    Abstract: A method of manufacturing a cutting tool is disclosed. An object of the manufacturing method of a cutting tool is to reduce contamination of an abrasive layer surface, particularly, agglomeration contamination due to slurry by improving hydrophobicity maintaining performance of an abrasive layer. A cutting tool according to the method of manufacturing comprises an abrasive layer on a base member, the abrasive layer having abrasives bonded to a surface thereof; and a coating on the surface of the abrasive layer that is a hydrophobic material film.
    Type: Application
    Filed: May 19, 2008
    Publication date: March 3, 2011
    Applicant: SHINHAN DIAMOND IND. CO., LTD.
    Inventors: Shin Kyung Kim, Kee Jung Cheong, Brian Song, Tae Jin Kim, Mun Seak Park, Byung Ju Min, Jeong Bin Jeon
  • Publication number: 20100329805
    Abstract: Disclosed is a diamond tool. The diamond tool is coupled to a processing apparatus and may form a hole in a workpiece. The diamond tool includes a shank coupled to a connection portion formed at one end thereof and further coupled to the processing apparatus. There is a cylindrical opening formed at the other end of the shank; and segments formed at intervals along the periphery of the shank, the segments come into contact with the workpiece to form a hole in the workpiece. Each of the segments has at least one linear groove formed on the inner surface thereof or at least one oblique groove formed on the outer surface thereof. The segments are improved in shape to achieve improved cutting and cooling performance, increased stiffness and durability, and reduced load upon processing.
    Type: Application
    Filed: June 24, 2010
    Publication date: December 30, 2010
    Applicant: Shinhan Diamond Ind. Co., Ltd.
    Inventors: Sung Ho Cho, Jong Seog Park, Byoung Chul Joo
  • Publication number: 20100307473
    Abstract: The present invention relates to a diamond tool for cutting a workpiece. An object of the present invention is to provide a diamond tool, wherein diamond granules are arranged at regular intervals with respect to an outer peripheral surface of a segment so that the diamond granules are uniformly arranged in a front face of the segment, which is a substantial cutting surface, thereby improving the cutting performance thereof and simultaneously maintaining a consistent performance during the service life of the diamond tool. A diamond tool of the present invention for achieving the object has a segment that is attached to an outer peripheral surface of a shank in the form of a wheel or plate and contains diamond granules, wherein the segment comprises a plurality of diamond granules arranged on a plurality of concentric circles having the same central axis as an outer periphery of the segment.
    Type: Application
    Filed: April 24, 2007
    Publication date: December 9, 2010
    Applicant: SHINHAN DIAMOND IND CO., LTD.
    Inventors: Hyun Woo Lee, Jong Hwan Park, Sung Kun Lee, Dae Geun Kim
  • Publication number: 20100294256
    Abstract: The present invention relates to a diamond tool for cutting a workpiece. An object of the present invention is to provide a diamond tool, wherein a wear-resistant region is formed in a connection portion between a segment and a shank of the diamond tool to prevent an under-cut phenomenon, to extend the service life of the diamond tool and to improve cutting quality due to easy discharge of cut chips. A diamond tool of the present invention for achieving the object has a cutting segment that contains a plurality of diamond granules and is attached to an outer peripheral surface of a shank, wherein the segment comprises an auxiliary cutting portion that has a thickness identical with that of the shank and a height and is attached to the shank; and a primary cutting portion that is integrally formed on the top of the auxiliary cutting portion and has a thickness larger than that of the auxiliary cutting portion.
    Type: Application
    Filed: April 24, 2007
    Publication date: November 25, 2010
    Applicant: SHINHAN DIAMOND IND. CO., LTD.
    Inventors: Hyun Woo Lee, Jong Hwan Park, Bu Kun Park, Jae Wook Lim
  • Publication number: 20100291845
    Abstract: The present invention relates to a diamond tool for cutting a work-piece. An object of the present invention is to provide a diamond tool, wherein diamond granules are arranged at outer peripheries of segments and on certain circumferences and placed in a radial pattern from a center of a shank of the diamond tool, so that a constant cutting force is maintained even though the segments are worn out, and thus, the same cutting force is maintained during the service life of the diamond tool. A diamond tool according to the present invention for achieving the object comprises a shank in the form of a wheel or disk; segments attached to an outer peripheral surface of the shank; and a plurality of diamond granules that are attached to the segments and arranged at an outer periphery of each of the segments and on a plurality of circumferences spaced apart by a certain distance from one another and are placed in a radial pattern from the center of the shank.
    Type: Application
    Filed: April 24, 2007
    Publication date: November 18, 2010
    Applicant: SHINHAN DIAMOND IND. CO., LTD.
    Inventors: Hyun Woo Lee, Jong Hwan Park, Seo Bong Byun, Kang Sun Lee
  • Publication number: 20100043304
    Abstract: Disclosed herein is a diamond tool and a method of manufacturing the same. The diamond tool includes a shank and a segment coupled to the shank having a compact having a plurality of grooves, and diamond particles inserted into the grooves and bonded to the compact. The grooves can be formed on the compact corresponding to a desired arrangement locations of the diamond particles. A metal powder injection molding method can be employed to prepare the compacts. More than one compact can be stacked to form the segment, so that the diamond particles can be arranged in various patterns in the segment, thereby achieving simplification of the process, which allows cost savings and process automation.
    Type: Application
    Filed: April 23, 2007
    Publication date: February 25, 2010
    Applicant: SHINHAN DIAMOND IND. CO., LTD.
    Inventors: Hyun Woo Lee, Jong Hwan Park, Sung Kun Lee, Shin Kyung Kim
  • Publication number: 20100048112
    Abstract: Disclosed herein is a diamond tool for cutting a workpiece and a method of manufacturing the same. The diamond tool includes a shank and a segment coupled to the shank. The segment includes a tape having a plurality of inserting sections formed on a surface of the tape, and diamond particles inserted into the inserting sections and bonded to the tape by pressure sintering. The inserting sections are formed in the tape corresponding to desired arrangement locations of the diamond particles. The diamond particles can be arranged in various patterns in the segment, thereby achieving simplification of the process, which allows process automation and reduces manufacturing costs.
    Type: Application
    Filed: April 23, 2007
    Publication date: February 25, 2010
    Applicant: SHINHAN DIAMOND IND. CO., LTD.
    Inventors: Hyun Woo Lee, Jong Hwan Park, Shin Kyung Kim, Dae Geun Kim