Abstract: The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (?Y/?X) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.
Abstract: Provided is a mounting device in which two or more semiconductor chips are laminated and mounted at a plurality of locations on a substrate, said mounting device including: a stage that supports the substrate; a bonding part that laminates and mounts the plurality of semiconductor chips on the substrate while heating the plurality of semiconductor chips and the substrate; and a heat insulating member that is interposed between the stage and the substrate, said heat insulating member including a first layer which is in contact with the substrate and to which heat is applied from the bonding part via the semiconductor chips and the substrate, and a second layer which is disposed closer to the stage side than the first layer, wherein the first layer has a larger heat resistance than the second layer.
Abstract: A mounting apparatus for manufacturing a semiconductor device by bonding a semiconductor chip (12) to a mounted object that is a substrate (30) or another semiconductor chip (12) is provided. The mounting apparatus includes: a stage (120) on which the substrate (30) is placed, a mounting head (124) that is capable of moving relative to the stage (120) and bonds the semiconductor chip (12) to the mounted object, and an irradiation unit (108 that irradiates, from a lower side of the stage (120), an electromagnetic wave transmitting through the stage and heating the substrate (30). The stage (120) has a first layer (122) formed on an upper surface side, and the first layer (122) has a greater thermal resistance in a plane direction than the thermal resistance in a thickness direction.
Abstract: A semiconductor mounting device for mounting chip components on a substrate, wherein the device is reduced in size. A semiconductor mounting device 10 comprises: a temporary placement stage 12 on which are loaded a plurality of chip components 30a, 30b, 30c; a conveyance head 14 that conveys the chip components 30a, 30b, 30c to the temporary placement stage 12, and also loads each of the chip components 30a, 30b, 30c on the temporary placement stage 12 so that the relative positions of the plurality of chip components 30a, 30b, 30c reach predetermined positions; a mounting stage 16 that secures a substrate 36 by suction; and a mounting head 18 that suctions the plurality of chip components 30a, 30b, 30c loaded on the temporary placement stage 12, and pressurizes while keeping the relative positions at prescribed positions on the substrate 36 that is secured by suction to the mounting stage 16.
Abstract: The present invention includes: a heat plate for heating a lower side of a substrate sliding on an upper surface; and a heat block for heating the heat plate. The heat block includes an air heating flow path for heating air which flows in from a bottom surface side and causing the air to flow out to the heat plate side, the heat plate includes air holes for discharging the air heated by the air heating flow path from the upper surface, the heated air discharged from the air holes forms a heated air atmosphere above the heat plate, and the substrate is transported through the heat air atmosphere. Thereby, curved deformation of the substrate is suppressed.
Abstract: A mounting apparatus (10) serves to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component. The mounting apparatus includes: a film winding mechanism (18) that rotates a winding reel (26) to wind in a film spanning from a dispensing reel to the winding reel (26), the film winding mechanism (18) executing the winding so that a new film is disposed on the bottom surface of the mounting head each time when an electronic component is mounted; a tension detecting part (38) that detects the tension of the film after the same is wound by the film winding mechanism (18); and a control part (20) that rotates the winding reel (26) by a winding motor (30) to adjust the tension on the basis of the tension detected by the tension detecting part (38). A film supply apparatus is also provided.
Abstract: The present invention has: a heater; and a bonding tool having a lower surface on which a memory chip is adsorbed; and an upper surface attached to the heater, and is provided with a bonding tool which presses the peripheral edge of the memory chip to a solder ball in a first peripheral area of the lower surface and which presses the center of the memory chip (60) to a DAF having a heat resistance temperature lower than that of the solder ball in a first center area. The amount of heat transmitted from the first center area to the center of the memory chip is smaller than that transmitted from the first peripheral area (A) to the peripheral edge of the memory chip. Thus, the bonding apparatus in which the center of a bonding member can be heated to a temperature lower than that at the peripheral edge can be provided.
Abstract: A method of mounting a die includes: preparing a die having a bump formation surface on which a plurality of bump electrodes are formed; disposing a vacuum suction tool having a suction surface above the die such that the suction surface faces toward the bump formation surface; sandwiching a porous sheet between the suction surface and the bump formation surface and suctioning the die by the vacuum suction tool; and mounting the die that has been suctioned by the vacuum suction tool in a bonding region of a substrate with an adhesive material interposed therebetween, the porous sheet having a thickness equal to or greater than the protrusion height of the bump electrodes on the bump formation surface. Stabilization and ease of maintenance of vacuum suction can thereby be improved.
Abstract: The apparatus which assists in deriving bonding conditions includes a bonding unit which bonds a semiconductor chip and a substrate by applying heat and pressure with NCF interposed therebetween, a library in which a variety of physical property information including viscosity characteristic information is collected with respect to each of a plurality of types of NCFs, an initial evaluation condition determination unit which acquires the physical property information corresponding to the NCF used for bonding with reference to the library and determines an initial value of an evaluation condition of bonding evaluation performed by bonding the semiconductor chip and the substrate, and a bonding evaluation unit which drives the bonding unit in accordance with set evaluation condition, bonds the semiconductor chip and the substrate and performs the bonding evaluation at least once to measure the viscosity of the NCF at the time of the bonding.
Abstract: There is disclosed a camera module manufacturing apparatus for joining together a lens unit that incorporates a taking lens and a sensor board to which an image sensor is attached. The camera module manufacturing apparatus includes an optical unit including a collimator lens and a measurement chart for forming an image of the measurement chart on the image sensor through the taking lens. The relative position of the lens unit and the sensor board is adjusted based on an image signal obtained by converting, using the image sensor, an image of the measurement chart that is formed on the image sensor by the optical unit. The measurement chart is disposed to be tilted with respect to a plane that is perpendicular to an optical axis of the collimator lens.
Abstract: A method for manufacturing a semiconductor device and a mounting apparatus are provided. The method for manufacturing a semiconductor device includes: a placing step for placing, on a bonding surface, a temporary substrate which is transmissive with respect to an alignment mark; an image acquisition step for acquiring an image of the alignment mark and an image of a semiconductor die; a correction step for correcting, on the basis of the image of the alignment mark and the image of the semiconductor die acquired in the image acquisition step, the position in the horizontal direction of a bonding head that pressure bonds the semiconductor die to the temporary substrate; and a pressure bonding step for pressure bonding the semiconductor die to the transmissive substrate on the basis of the corrected position in the horizontal direction.
Abstract: This detachment device is provided with: a collet including a contact surface that comes into surface contact with a surface of a protective film adhering to an adhesion member attached on a workpiece, and including a suction hole that is provided in the contact surface and that sucks the protective film; and a movement mechanism that moves the collet relative to the workpiece, wherein while the protective film is being sucked by the suction hole, the collet is separated from the workpiece so that the protective film is detached from the adhesion member. Accordingly, the detachment device capable of more assuredly detaching the protective film from the workpiece is provided.
Abstract: A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.
Abstract: This flux transfer apparatus (10) comprises: a stage (12) having a recessed portion (13) for collecting flux (51); a flux pot (20) which is an annular member having a through hole (21) into which the flux (51) is introduced, which reciprocates along a top surface (14) of the stage (12) to supply the flux (51) that has been introduced into the through hole (21) into the recessed portion (13), and which levels off the top surface of the flux using a bottom surface (22); and a cooling mechanism (30) for cooling the stage (12). By this means, a rise in the temperature of the stage in the flux collecting apparatus is suppressed.
Abstract: A mounting apparatus includes: a bonding stage; a base; a mounting head for performing a temporary press-attachment process in which semiconductor chips are suction-held and temporarily press-attached to a mounted object and a final press-attachment process in which the temporarily press-attached semiconductor chips are finally press-attached; a film arrangement mechanism arranged on the bonding stage or the base; and a controller which controls driving of the mounting head and the film arrangement mechanism. The film arrangement mechanism includes: a film feed-out mechanism which has a pair of feed rollers with a cover film extended there-between and successively feeds out a new cover film; and a film movement mechanism which moves the cover film in a horizontal direction with respect to a substrate.
Abstract: [Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding device 10 for thermally bonding an electronic component 100 to a substrate 110 or to another electronic component via an adhesive material 112, the bonding device being provided with: a bonding tool 40 comprising a bonding distal-end portion 42 which includes a bonding surface 44 and tapered side surfaces 46 formed in a tapering shape becoming narrower toward the bonding surface 44, the bonding surface 44 having a first suction hole 50 for suction-attaching the electronic component 100 via an individual piece of a porous sheet 130, the tapered side surfaces 46 having second suction holes 52, 54 for suction-attaching the porous sheet 130; and a bonding control unit 30 which controls the first suction hole 50 and the second suction holes 52, 54 independently from each other.
Abstract: A wire bonding method comprises: preparing a wire bonding apparatus; a step of forming a free air ball; a first height measuring step of measuring the height of a first electrode by detecting whether the free air ball is grounded to the first electrode; a second height measuring step of measuring the height of a second electrode by detecting whether the free air ball is grounded to the second electrode; a first bonding step of controlling the height of a bonding tool based on the measurement result in the first height measuring step, and bonding the free air ball to the first electrode; and a second bonding step of controlling the height of the bonding tool based on the measurement result in the second height measuring step, and bonding a wire to the second electrode to connect the first and the second electrodes. Thus, electrodes can be correctly bonded.
Abstract: This wire clamp apparatus calibration method comprises: a step for driving a driving piezoelectric element by applying a predetermined frequency that causes a pair of arm portions to vibrate in an opening/closing direction; a step for detecting whether or not end portions of the pair of arm portions collide with each other on the basis of an output current outputted from the driving piezoelectric element when the pair of arm portions are vibrating in the opening/closing direction; a step for calculating, on the basis of the detection result, reference voltages in a state where the pair of arm portions are closed; and a step for performing calibration of a drive voltage to be applied to the driving piezoelectric element on the basis of the reference voltages. Accordingly, accuracy improvement and stabilization in an opening/closing operation of the wire clamp apparatus can be achieved.
Abstract: The mounting apparatus includes: a bonding head 14 that bonds, while pressing, a semiconductor chip 100 onto a substrate 110 or another semiconductor chip 100; and a heating mechanism 16 that heats the semiconductor chip 100 from the side during the execution of this bonding. After two or more semiconductor chips 100 are stacked while being bonded by temporary pressure-bonding, the bonding head 14 heats and applies pressure to an upper surface of the resultant stacked body, thereby integrally pressure-bonding the two or more semiconductor chips 100, and at the time of this pressure-bonding the heating mechanism 16 heats the stacked body from the side.