Patents Assigned to Shinkawa U.S.A., Inc.
  • Wire bend inspection method and apparatus
    Patent number: 5818958
    Abstract: A method and apparatus for inspecting bends in wires bonded between, for instance, pads of semiconductor chips and leads of lead frames using detection ranges established within imaging ranges in which images of bends are taken. Imaging range areas are established by dividing the distance between a first bonding point and a second bonding point of a target wire by the width of the detection range, and the wire bend is then detected in the respective imaging range areas.
    Type: Grant
    Filed: November 25, 1996
    Date of Patent: October 6, 1998
    Assignees: Kabushiki Kaisha Shinkawa, Shinkawa U.S.A., Inc.
    Inventors: Hiromi Tomiyama, Takeyuki Nakagawa, Naoki Kanayama
  • Pellet conveying device
    Patent number: 5599159
    Abstract: A pellet conveying device used with a bonding machine for, for example, semiconductor devices, including a conveying arm that has a collet for holding pellets. The conveying arm can move vertically and pivot horizontally by two different driving sources so that the collet can be moved between predetermined two positions such as a pellet pick-up position and a pellet releasing position.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: February 4, 1997
    Assignees: Kabushiki Kaisha Shinkawa, Shinkawa U.S.A., Inc.
    Inventors: Kazuo Sugiura, Yoshimitsu Hisajima, Naoki Kanayama