Patents Assigned to Shinkawa U.S.A. Incorporated
  • Method and apparatus for wire bonding
    Patent number: 5791550
    Abstract: So as to prevent improper wire feeding, a vibration applying device such as an electromagnetic means, etc., is provided which applies a vibration to a spool when the spool is rotated in order to feed out a wire from the spool.
    Type: Grant
    Filed: August 2, 1996
    Date of Patent: August 11, 1998
    Assignee: Shinkawa U.S.A. Incorporated
    Inventor: Yuji Kobayashi