Patents Assigned to Shinko Co., Ltd.
  • Publication number: 20180192576
    Abstract: [Object] Provided is a steelmaking slag-coated seed and a method for producing the same, which can be produced with less time and effort of a worker and at lower cost, and yet can include a sufficient amount of a uniform coating layer based on steelmaking slag. [Solution] A steelmaking slag-coated seed includes a seed of a rice plant or the like and a steelmaking slag layer formed on an outside of the seed; the steelmaking slag layer is a covering layer made of steelmaking slag powder obtained by pulverizing steelmaking slag; the steelmaking slag contains a prescribed amount or more of calcium relative to all components of the steelmaking slag.
    Type: Application
    Filed: July 15, 2016
    Publication date: July 12, 2018
    Applicants: NIPPON STEEL & SUMITOMO METAL CORPORATION, THE SANGYO SHINKO CO., LTD.
    Inventors: Kimio ITO, Shuichi ITO, Kohei OZAKI
  • Patent number: 9157504
    Abstract: An anchoring device secures tendons formed of a filament body made of fiber reinforced plastic by inserting a male member into a female member to sandwich the tendons between them. Each of the female member and the male member is formed in a tapered shape inclined from one end toward the other end and the female member and the male member include a plurality of mount portions at predetermined intervals in a circumferential direction of an inclined tapered face between the female member and the male member, each of the plurality of tendons being placed on a different one of the mount portions. The length from the one end to the other end of each of the female member and the male member corresponding to a length direction of the tapered face in contact with the tendon is equal to or larger than 130 mm.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: October 13, 2015
    Assignees: KYOKUTO KOGEN CONCRETE SHINKO CO., LTD., TOKYO ROPE MANUFACTURING CO., LTD.
    Inventors: Koji Watanabe, Minoru Okada, Yanke Zhao, Takayuki Okeno
  • Patent number: 6178566
    Abstract: A toilet housing and waste collection and treatment system purify wastewater to a satisfactory level. When solid wastes are conveyed from individual toilets (31)-(33) into an active circulation chamber (16) in a toilet housing (10), the solid wastes are subjected to air exposure treatments in the active circulation chamber (16). The wastewater exposed to air in the active circulation chamber (16) is then purified through a three-phase flowing structure in first and second active water chambers (51) and (52), with the three-phase flowing structure including water, air, and carrier particles containing aerobic microorganisms. The wastewater so treated flows into first and second sediment separation chambers (53) and (54) where solid wastes are settled down and separated from the wastewater. The treated water is then supplied to a water reservoir (56) which in turns supplies the water to the respective toilets (31)-(33).
    Type: Grant
    Filed: December 10, 1998
    Date of Patent: January 30, 2001
    Assignee: Nihon Shinko Co., Ltd.
    Inventor: Hitoshi Yagi
  • Patent number: 5457847
    Abstract: A casing having an air discharging chamber and an air sucking chamber is provided with a first jetting nozzle and a second jetting nozzle on the underside thereof. The first jetting nozzle and the second jetting nozzle jet supersonic airs such as to approach each other. A sucking nozzle is located between the first jetting nozzle and the second jetting nozzle to allow the working air to be sucked in the casing.
    Type: Grant
    Filed: December 20, 1993
    Date of Patent: October 17, 1995
    Assignee: Shinko Co. Ltd.
    Inventors: Hiroshi Uzawa, Shunji Hayashi
  • Patent number: 5459207
    Abstract: Disclosed are a resorcinol resin adhesive composition which comprises a resorcinol resin modified by m-aminophenol, and a process for bonding wood materials by using the same.
    Type: Grant
    Filed: May 23, 1994
    Date of Patent: October 17, 1995
    Assignee: Oshika Shinko Co., Ltd.
    Inventors: Yuki Saigan, Mitsutoshi Ogawa
  • Patent number: 5405705
    Abstract: There is disclosed a method for preparing a resin-reinforced decorative board which comprises the steps of interposing a polymerizable gelatinous substance between a decorative veneer and a base board, pressurizing and heating the materials to permeate at least part of components constituting the gelatinous substance to the decorative veneer or both of the decorative veneer and the base board, and polymerizing the substance to laminate the decorative veneer and the base board through an adhesive layer.
    Type: Grant
    Filed: December 11, 1992
    Date of Patent: April 11, 1995
    Assignees: Oshika Shinko Co., Ltd., Kuraray Co., Ltd.
    Inventors: Masaru Fujimoto, Masami Kondo, Michio Chatani, Tadayuki Tsuchiya
  • Patent number: 5388304
    Abstract: A bottom wall of an air discharging chamber in a cleaner head is formed with an air jetting slit. The air jetting slit is arranged in the substantially perpendicular direction to the advancing direction of a panellike body. A bottom wall of an air sucking chamber in the cleaner head is provided with an air sucking slit located in parallel with the air jetting slit. The air discharging chamber includes a supersonic generator therein. The supersonic generator is provided with a continuous groove in parallel with the air jetting slit. The air is turned into an air flow incorporating ultrasonic waves after being passed through the continuous groove, and is successively jetted from the air jetting slit.
    Type: Grant
    Filed: January 5, 1993
    Date of Patent: February 14, 1995
    Assignee: Shinko Co., Ltd.
    Inventor: Sanae Takada
  • Patent number: 5223587
    Abstract: Disclosed is an adhesive composition for wood comprising a phenol resin adhesive and a phenol resin highly condensed in a mole ratio (F/P) of formaldehyde (F) to a phenol (P) in the range of 0.8:1 to 1.5:1, having a softening point of 100.degree. to 200.degree. C. and having a number average molecular weight of 2,000 or more, whereby the adhesive is accelerated in hardening to impart fast setting-ability thereto, which causes the pressing temperature to be reduced and makes it possible to raise the allowable moisture content of adherends.
    Type: Grant
    Filed: August 7, 1992
    Date of Patent: June 29, 1993
    Assignee: Oshika Shinko Co. Ltd.
    Inventor: Natsuhi Tsuruta
  • Patent number: 5200458
    Abstract: An adhesive composition can be provided which comprises a vinyl acetate polymer emulsion containing acetoacetylated polyvinyl alcohol as a protective colloid and a calcium silicate alone or the calcium silicate and an isocyanate compounded therein, which can solve the disadvantages observed in the adhesives of systems in which the isocyanates are added to the emulsions like the prior art, and which retains the adhesive strength for a long time, particularly has a little reduction in initial adhesive strength, and is excellent in water resistance (water-resistant adhesion) and also in heat resistance (heat-resistant adhesion) compared to those of the prior-art adhesives.
    Type: Grant
    Filed: May 30, 1991
    Date of Patent: April 6, 1993
    Assignee: Oshika Shinko Co., Ltd.
    Inventors: Masaharu Iwasaki, Takashi Yonehara, Hiroyasu Morinaga, Satoshi Okajima, Katsuhiro Koda
  • Patent number: 4307206
    Abstract: A urea-formaldehyde resin adhesive comprising a powder of a substance having the property of gradually reacting with an acid and thus consuming the acid.
    Type: Grant
    Filed: July 7, 1980
    Date of Patent: December 22, 1981
    Assignees: Oshika Shinko Co., Ltd., Mitsuo Higuchi, Isao Sakata
    Inventors: Mitsuo Higuchi, Isao Sakata