Abstract: A waveform synthesizing circuit comprises a plurality of signal output switching means for outputting predetermined magnitudes of voltage or current signals when a voltage or current value of an input pulse reaches preliminarily assigned comparing reference values, a signal summing means for superimposing output signals from a plurality of signal output switching means for summing, and a comparing signal switching means detecting the rising and falling of the input pulse, providing the comparing reference values with given differences between a plurality of signal output switching means according to an order of operation of a plurality of signal output switching means upon the detection of a rise, and providing the comparing reference values, which are different from those for rising, with given differences between a plurality of signal output switching means according to an order of operation of a plurality of signal output switching means upon the detection of a fall.
Type:
Grant
Filed:
June 9, 1992
Date of Patent:
July 5, 1994
Assignees:
Shinko Electric Ind., Co., Ltd., Fujitsu Ltd.
Abstract: A process for manufacturing a multi-layer lead frame for a semiconductor device comprises two metal plains being adhered to each other via an insulation piece. An insulation strip is punched to cut the insulation piece, which is preliminary adhered to a metal strip. The metal strip is then punched to cut and remove the metal plane, which is then laminated and heat-pressed to another metal strip. After completely adhered, the other metal strip is punched to remove a multi-layer lead frame.
Type:
Grant
Filed:
September 28, 1994
Date of Patent:
October 22, 1996
Assignees:
Shinko Electric Ind. Co, Ltd., Intel Corporation