Abstract: A load port particularly well-suited to application in batch processing semiconductor manufacturing processes is provided with a load port main body having a main table onto which a FOUP containing wafers is placed, a mapping means for mapping the wafers contained within the FOUP, and the like, and is further provided with a displacing means for moving the FOUP placed on the main table between the main table and a predetermined position removed a distance from the load port main body, in which the displacing mechanism is provided with an open space enabling the passing of a FOUP which contains wafers between the aforementioned predetermined position and a piece of equipment located adjacent to the load port main body.