Abstract: Provided are a complex optical film and a light source assembly including the same. The complex optical film includes a first substrate, a light shielding layer formed on a bottom surface of the first substrate, an optical pattern layer formed on a top surface of the first substrate and including concavo-convex portions, a second substrate disposed on the first substrate, and a first adhesive layer disposed under the second substrate, wherein the light shielding layer includes a binder and organic particles and inorganic particles dispersed in the binder, the convex portions of the optical pattern layer at least partially penetrate into the first adhesive layer to be combined with the first adhesive layer, and a low-refraction area having a lower refractive index than the optical pattern layer and the first adhesive layer is defined between the first adhesive layer and the optical pattern layer.

Abstract: Provided are a complex optical film and a light source assembly including the same. The complex optical film includes a first substrate, a light shielding layer formed on a bottom surface of the first substrate, an optical pattern layer formed on a top surface of the first substrate and including concavo-convex portions, a second substrate disposed on the first substrate, and a first adhesive layer disposed under the second substrate, wherein the light shielding layer includes a binder and organic particles and inorganic particles dispersed in the binder, the convex portions of the optical pattern layer at least partially penetrate into the first adhesive layer to be combined with the first adhesive layer, and a low-refraction area having a lower refractive index than the optical pattern layer and the first adhesive layer is defined between the first adhesive layer and the optical pattern layer.

Abstract: An electroconductive adhesive tape used for electrical and electronic products to bond or fix an element to a support while maintaining an electrical conductivity between the element and support. The electroconductive adhesive tape includes a perforated synthetic film, two metal plating layers respectively formed on both surfaces of the synthetic resin film, and a conductive adhesive layer formed on one of the metal plating layers. Made to be very thin, the film has the advantage of being flexible and high in tensile strength in addition to showing excellent electrical conductivity. The metal plating layers are integratedly formed through the perforations of the synthetic resin film, maintaining excellent electrical conductivity. Thus, the electroconductive adhesive tape maintains a desired strength while exhibiting a high flexibility and a high bondability.

Abstract: An electroconductive adhesive tape used for electrical and electronic products to bond or fix an element to a support while maintaining an electrical conductivity between the element and support. The electroconductive adhesive tape includes a perforated synthetic film, two metal plating layers respectively formed on both surfaces of the synthetic resin film, and a conductive adhesive layer formed on one of the metal plating layers. Made to be very thin, the film has the advantage of being flexible and high in tensile strength in addition to showing excellent electrical conductivity. The metal plating layers are integratedly formed through the perforations of the synthetic resin film, maintaining excellent electrical conductivity. Thus, the electroconductive adhesive tape maintains a desired strength while exhibiting a high flexibility and a high bondability.

Abstract: The present invention relates to a conductive polymer composition which exhibits PTC characteristics (PTC composition) and a PTC device comprising it, wherein the PTC composition comprises: a) at least one crystalline olefin-based polymer and at least one ionomer; and, b) electrically conductive particles which have been dispersed in polymer matrix formed by a). The PTC composition according to the present invention has an enhanced adhesion to electrodes, which minimizes contact resistance and increases the maximum working current (hold current). The PTC device comprising the PTC composition can be used as a circuit protection device which protects circuit from overflowing and which holds initial resistance value although it is reused after multiple short circuit have taken place.

Abstract: The present invention relates to an electroconductive adhesive tape used for electrical and electronic products to bond or fix an element to a support while maintaining an electrical conductivity between the element and support. The electroconductive adhesive tape comprises a perforated synthetic film, two metal plating layers respectively formed on both surfaces of the synthetic resin film, and a conductive adhesive layer formed on one of the metal plating layers. Made to be very thin, the film has the advantage of being flexible and high in tensile strength in addition to showing excellent electrical conductivity. The metal plating layers are integratedly formed through the perforations of the synthetic resin film, maintaining excellent electrical conductivity. Thus, the electroconductive adhesive tape maintains a desired strength while exhibiting a high flexibility and a high bondability.